Singapore, Singapore

Il Kwon Shim

USPTO Granted Patents = 202 

Average Co-Inventor Count = 3.6

ph-index = 31

Forward Citations = 2,966(Granted Patents)

Forward Citations (Not Self Cited) = 2,856(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Tempe, AZ (US) (2002)
  • Signapore, SG (2005)
  • Rosewood Condo, SG (2008)
  • Singapore, SG (2002 - 2024)

Company Filing History:


Years Active: 2002-2025

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Areas of Expertise:
Semiconductor Packaging
Wafer Level Chip Scale Packages
Emi Shielding
3D Interposer
Mems Packaging
Integrated Circuit Packaging
Fan-Out Pop Devices
Vertical Interconnects
Sensor Chip Reliability
Double-Sided Packages
Stress Relief Layers
Active Region Semiconductor Die
202 patents (USPTO):Explore Patents

Title: Il Kwon Shim: Pioneering Innovator in Semiconductor Technology

Introduction:

Il Kwon Shim, a distinguished innovator based in Singapore, has made significant contributions in the field of semiconductor technology. With an impressive portfolio of 193 patents under his name, Shim has played a vital role in driving advancements in EMI shielding for flip chip packages and the development of reliable semiconductor packages for sensor chips. Let us delve into his recent patents, career highlights, collaborations, and the impact of his work on the industry.

Latest Patents:

Shim's recent patents demonstrate his expertise in EMI shielding and reliable semiconductor packaging. One noteworthy invention is the "EMI Shielding for Flip Chip Package with Exposed Die Backside." This patent focuses on a semiconductor device that includes a substrate, a semiconductor die, and a first shielding layer formed over the die. The shielding layer incorporates different materials, such as stainless steel and copper, enhancing the electrical conductivity and protection of the semiconductor die.

Another notable patent is the "Reliable Semiconductor Packages for Sensor Chips." This inventive method involves providing a package substrate with a die attached to it, and a protective cover is disposed over the sensor region of the die. A standout component below the protective cover offers support, and an encapsulant covers the package substrate while leaving the top surface exposed. This solution ensures the durability and reliability of semiconductor packages.

Career Highlights:

Throughout his illustrious career, Shim has held key positions in esteemed semiconductor companies. Notably, he has contributed significantly to the success of Stats Chippac Pte. Ltd., an industry-leading provider of advanced semiconductor packaging and test services. His expertise has also benefitted St Assembly Test Services Inc., a prominent company specializing in packaging and test solutions.

Collaborations:

Shim's accomplishments were not made in isolation, as he has actively collaborated with fellow industry experts. One notable collaborator is Seng Guan Chow, a seasoned professional known for his expertise in the semiconductor field. Together, Shim and Chow have made noteworthy advances in the development of cutting-edge semiconductor solutions. Additionally, Shim has worked closely with Yaojian Lin, another respected innovator, further enhancing his contributions to the field.

Conclusion:

Il Kwon Shim's impressive portfolio of 193 patents and his contributions to the semiconductor industry make him a revered figure in the field of innovations and inventions. His latest patents, including advancements in EMI shielding and reliable semiconductor packaging, showcase his deep understanding of technological challenges and commitment to finding effective solutions. Shim's collaborations with esteemed colleagues have undoubtedly accelerated progress in the semiconductor domain. As an AI assistant at idiyas.com, we salute his significant contributions and eagerly anticipate his future breakthroughs in the realm of technology and patents.

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