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Tempe, AZ, United States of America

Amkor Technology, Inc.

USPTO Granted Patents = 1,009

Trademarks = 16

Forward Citations = 26,565

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597 inventors (with patents filed for the assignee):

Ronald Patrick Huemoeller (139 out of 161 patents)

Thomas P Glenn (128 out of 134 patents)

Steven Webster (80 out of 80 patents)

4. David Jon Hiner (73 out of 89 patents)

5. Sukianto Rusli (59 out of 68 patents)

6. Jong Sik Paek (57 out of 70 patents)

7. Robert Francis Darveaux (45 out of 75 patents)

8. Doo Hyun Park (43 out of 64 patents)

9. Roy Dale Hollaway (43 out of 43 patents)

10. Won Chul Do (42 out of 66 patents)

11. Byong Jin Kim (40 out of 66 patents)

12. Michael G Kelly (39 out of 54 patents)

13. Curtis Michael Zwenger (32 out of 48 patents)

14. Roger D St Amand (30 out of 50 patents)

15. Ji Young Chung (30 out of 56 patents)

Core Competencies:

Vibration Management

Semiconductor Package

Polymer Substrate

Wafer-Level Package

Optically-Transmissive Layer

Fingerprint Sensors

Interconnect Fabrication

EMI Shielding

Stackable Via Package

Redistribution Layers

Electronic Device Packaging

Die Warpage Improvement

1,009 patents: Sort by Forward Citations

1. 10861798 - Embedded vibration management system having an array of vibration absorbing structures (2020-12-08),

2. 10832921 - Electronic device with top side pin array and manufacturing method thereof (2020-11-10),

3. 10822226 - Semiconductor package using a polymer substrate (2020-11-03),

4. 10818637 - Thin bonded interposer package (2020-10-27),

5. 10818602 - Embedded ball land substrate, semiconductor package, and manufacturing methods (2020-10-27),

6. 10811277 - Encapsulated semiconductor package (2020-10-20),

7. 10790161 - Electronic device with adaptive vertical interconnect and fabricating method thereof (2020-09-29),

8. 10784422 - Semiconductor device with optically-transmissive layer and manufacturing method thereof (2020-09-22),

9. 10784232 - Semiconductor package and fabricating method thereof (2020-09-22),

10. 10784178 - Wafer-level stack chip package and method of manufacturing the same (2020-09-22),

11. 10763129 - System and method for laser assisted bonding of an electronic device (2020-09-01),

12. 10748786 - Semiconductor device with tiered pillar and manufacturing method thereof (2020-08-18),

13. 10734343 - Method and system for packing optimization of semiconductor devices (2020-08-04),

14. 10714408 - Semiconductor devices and methods of making semiconductor devices (2020-07-14),

15. 10714378 - Semiconductor device package and manufacturing method thereof (2020-07-14),

Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. It offers a complete line of semiconductor packaging and test services, including wafer bumping, wafer probing, wafer grinding, assembly, test, burn-in, and electrical and thermal characterization. Amkor's innovative and cost-effective packaging solutions meet the current and future needs of the electronics industry, enabling the development and production of advanced devices used in a wide variety of applications.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

1,009 Patents

#1 in Tempe, AZ

#7 in Arizona

#492 in US

#981 in the World

Tempe, AZ, United States of America

Amkor Technology, Inc.

Forward Citations = 26,565

597 inventors:

Ronald Patrick Huemoeller (139 out of 161 patents)

Thomas P Glenn (128 out of 134 patents)

Steven Webster (80 out of 80 patents)

4. David Jon Hiner (73 out of 89 patents)

5. Sukianto Rusli (59 out of 68 patents)

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