Assignee

Amkor Technology, Inc.

Patents = 1,009

Trademarks = 17

Forward Citations = 26,364

where 'Filed Patents' based on already Granted Patents

where 'Inventors Filed' based on already Granted Patents

597 inventors (with patents filed for the assignee):

Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. It offers a complete line of semiconductor packaging and test services, including wafer bumping, wafer probing, wafer grinding, assembly, test, burn-in, and electrical and thermal characterization. Amkor's innovative and cost-effective packaging solutions meet the current and future needs of the electronics industry, enabling the development and production of advanced devices used in a wide variety of applications.

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