For the Inventor, By the Inventor

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Tempe, AZ, United States of America

Amkor Technology, Inc.

USPTO Granted Patents = 1,009

% Expired Patents = 6.6

Trademarks = 15

Forward Citations = 26,908

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597 inventors (with patents filed for the assignee):

Ronald Patrick Huemoeller (139 out of 163 patents)

Thomas P Glenn (128 out of 134 patents)

Steven Webster (80 out of 80 patents)

4. David Jon Hiner (73 out of 91 patents)

5. Sukianto Rusli (59 out of 68 patents)

6. Jong Sik Paek (57 out of 72 patents)

7. Robert Francis Darveaux (45 out of 79 patents)

8. Doo Hyun Park (43 out of 65 patents)

9. Roy Dale Hollaway (43 out of 43 patents)

10. Won Chul Do (42 out of 69 patents)

11. Byong Jin Kim (40 out of 73 patents)

12. Michael G Kelly (39 out of 54 patents)

13. Curtis Michael Zwenger (32 out of 51 patents)

14. Roger D St Amand (30 out of 50 patents)

15. Ji Young Chung (30 out of 56 patents)

Core Competencies:

Semiconductor Package

Vibration Management

Interconnect Structures

Embedded Die

Wafer-Level Packaging

Fingerprint Sensors

Thermal Management

Optically-Transmissive Layer

Stackable Packages

High Routing Density

Polymer Substrate

Laser Assisted Bonding

1,009 patents: Sort by Forward Citations

1. 10861798 - Embedded vibration management system having an array of vibration absorbing structures (2020-12-08),

2. 10832921 - Electronic device with top side pin array and manufacturing method thereof (2020-11-10),

3. 10822226 - Semiconductor package using a polymer substrate (2020-11-03),

4. 10818637 - Thin bonded interposer package (2020-10-27),

5. 10818602 - Embedded ball land substrate, semiconductor package, and manufacturing methods (2020-10-27),

6. 10811277 - Encapsulated semiconductor package (2020-10-20),

7. 10804232 - Semiconductor device with thin redistribution layers (2020-10-13),

8. 10790161 - Electronic device with adaptive vertical interconnect and fabricating method thereof (2020-09-29),

9. 10784422 - Semiconductor device with optically-transmissive layer and manufacturing method thereof (2020-09-22),

10. 10784232 - Semiconductor package and fabricating method thereof (2020-09-22),

11. 10784178 - Wafer-level stack chip package and method of manufacturing the same (2020-09-22),

12. 10763129 - System and method for laser assisted bonding of an electronic device (2020-09-01),

13. 10748786 - Semiconductor device with tiered pillar and manufacturing method thereof (2020-08-18),

14. 10734343 - Method and system for packing optimization of semiconductor devices (2020-08-04),

15. 10714408 - Semiconductor devices and methods of making semiconductor devices (2020-07-14),

Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. It offers a complete line of semiconductor packaging and test services, including wafer bumping, wafer probing, wafer grinding, assembly, test, burn-in, and electrical and thermal characterization. Amkor's innovative and cost-effective packaging solutions meet the current and future needs of the electronics industry, enabling the development and production of advanced devices used in a wide variety of applications.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

Amkor Technology, Inc.

1,009 Patents

#1 in Tempe, AZ

#7 in Arizona

#510 in US

#1,013 in the World

Tempe, AZ, United States of America

Amkor Technology, Inc.

Forward Citations = 26,908

597 inventors:

Ronald Patrick Huemoeller (139 out of 163 patents)

Thomas P Glenn (128 out of 134 patents)

Steven Webster (80 out of 80 patents)

4. David Jon Hiner (73 out of 91 patents)

5. Sukianto Rusli (59 out of 68 patents)

Please report any incorrect information to [email protected]

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