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Tempe, AZ, United States of America

Amkor Technology, Inc.

USPTO Granted Patents = 1,009

% Expired Patents = 6.6

Trademarks = 15

Forward Citations = 26,908

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597 inventors (with patents filed for the assignee):

Ronald Patrick Huemoeller (139 out of 163 patents)

Thomas P Glenn (128 out of 134 patents)

Steven Webster (80 out of 80 patents)

4. David Jon Hiner (73 out of 91 patents)

5. Sukianto Rusli (59 out of 68 patents)

6. Jong Sik Paek (57 out of 72 patents)

7. Robert Francis Darveaux (45 out of 79 patents)

8. Doo Hyun Park (43 out of 65 patents)

9. Roy Dale Hollaway (43 out of 43 patents)

10. Won Chul Do (42 out of 69 patents)

11. Byong Jin Kim (40 out of 73 patents)

12. Michael G Kelly (39 out of 54 patents)

13. Curtis Michael Zwenger (32 out of 51 patents)

14. Roger D St Amand (30 out of 50 patents)

15. Ji Young Chung (30 out of 56 patents)

Core Competencies:

Semiconductor Package

Vibration Management

Interconnect Structures

Embedded Die

Wafer-Level Packaging

Fingerprint Sensors

Thermal Management

Optically-Transmissive Layer

Stackable Packages

High Routing Density

Polymer Substrate

Laser Assisted Bonding

1,009 patents: Sort by Forward Citations

1. 10861798 - Embedded vibration management system having an array of vibration absorbing structures (2020-12-08),

2. 10832921 - Electronic device with top side pin array and manufacturing method thereof (2020-11-10),

3. 10822226 - Semiconductor package using a polymer substrate (2020-11-03),

4. 10818637 - Thin bonded interposer package (2020-10-27),

5. 10818602 - Embedded ball land substrate, semiconductor package, and manufacturing methods (2020-10-27),

6. 10811277 - Encapsulated semiconductor package (2020-10-20),

7. 10804232 - Semiconductor device with thin redistribution layers (2020-10-13),

8. 10790161 - Electronic device with adaptive vertical interconnect and fabricating method thereof (2020-09-29),

9. 10784422 - Semiconductor device with optically-transmissive layer and manufacturing method thereof (2020-09-22),

10. 10784232 - Semiconductor package and fabricating method thereof (2020-09-22),

11. 10784178 - Wafer-level stack chip package and method of manufacturing the same (2020-09-22),

12. 10763129 - System and method for laser assisted bonding of an electronic device (2020-09-01),

13. 10748786 - Semiconductor device with tiered pillar and manufacturing method thereof (2020-08-18),

14. 10734343 - Method and system for packing optimization of semiconductor devices (2020-08-04),

15. 10714408 - Semiconductor devices and methods of making semiconductor devices (2020-07-14),

Company Overview

Amkor Technology, Inc., headquartered in Tempe, Arizona, specializes in semiconductor packaging solutions that are critical for the performance and reliability of electronic devices. The company focuses on advanced technologies such as wafer-level packaging, embedded die, and interconnect structures, catering to a diverse range of applications including consumer electronics and automotive systems. Amkor is also known for its innovations in vibration management, thermal management, and optically-transmissive layers, enhancing the functionality of modern semiconductor devices.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

1,009 Patents

#1 in Tempe, AZ

#7 in Arizona

#513 in US

#1,017 in the World

Tempe, AZ, United States of America

Amkor Technology, Inc.

Forward Citations = 26,908

597 inventors:

Ronald Patrick Huemoeller (139 out of 163 patents)

Thomas P Glenn (128 out of 134 patents)

Steven Webster (80 out of 80 patents)

4. David Jon Hiner (73 out of 91 patents)

5. Sukianto Rusli (59 out of 68 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Amkor Technology, Inc.. Retrieved from https://idiyas.com/company/amkor-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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