Tempe, AZ, United States of America

Roger D St Amand

This inventor holds 50 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignees: Amkor Technology, Inc., Amkor Technology Singapore Holding Pte. Ltd., Microchip Technology Inc.. Active years: 1999-2025.

USPTO Granted Patents = 50 

% Patents Active = 98.0

Average Co-Inventor Count = 2.8

ph-index = 18

Forward Citations = 1,216(Granted Patents)

Forward Citations (Not Self Cited) = 1,180(Dec 10, 2025)


Location History:

  • Temple, AZ (US) (1999)
  • Tempe, AZ (US) (2000 - 2024)

Company Filing History:


Years Active: 1999-2025

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Areas of Expertise:
Semiconductor Devices
Stackable Package
Flip Chip Structure
Thin Bonded Interposer
TMV Packages
RF Transceiver Module
Die Assembly
Electronic Device Manufacturing
Carrier Assisted Substrate
Power-Up Cycle
Fan Out Build Up
Underfill Contacting
50 patents (USPTO):Explore Patents

Title: Roger D St Amand: Innovator Extraordinaire from Tempe, AZ

Introduction:

Roger D St Amand, a prolific inventor hailing from Tempe, Arizona, is a renowned name in the field of semiconductor devices and technologies. With an impressive portfolio of 46 patents and an exceptional career history, St Amand has made significant contributions to the world of innovation. This article will delve into his latest patents, career highlights, notable collaborations, and conclude with a tribute to his remarkable achievements.

Latest Patents:

Among Roger D St Amand's recent patents, one noteworthy invention is titled "Semiconductor devices and methods of manufacturing semiconductor devices." This patent introduces a novel semiconductor device comprising multiple electronic components interconnected through conductive structures and coupling mechanisms. The configuration allows for improved functionality while optimizing space utilization, paving the way for more advanced and compact electronic devices.

Another significant addition to St Amand's patent portfolio is the invention entitled "Semiconductor package with front side and back side redistribution structures and fabricating method thereof." This patent presents a semiconductor device structure with a thin and fine-pitch redistribution structure, enabling enhanced performance and manufacturing efficiency.

Career Highlights:

Throughout his career, Roger D St Amand has primarily worked with two prominent companies in the semiconductor industry. He has contributed his expertise to Amkor Technology, Inc., a leading advanced packaging and test services provider. Additionally, St Amand has made significant contributions to Microchip Technology Inc., a distinguished semiconductor manufacturer specializing in microcontrollers and analog semiconductors.

Collaborations:

In his journey as an innovator, Roger D St Amand has collaborated with notable individuals who share his passion for semiconductor technology. Among his esteemed coworkers, Vladimir Perelman, and Robert Francis Darveaux stand out for their valuable contributions and joint efforts in bringing groundbreaking inventions to fruition. Their collaborations have undoubtedly played a vital role in expanding the boundaries of semiconductor advancements.

Conclusion:

Roger D St Amand's remarkable career, comprising 46 patented inventions, speaks volumes about his unwavering commitment to innovation. His contributions to the field of semiconductor devices and manufacturing methodologies have significantly influenced the industry's landscape. Collaborating with industry-leading companies such as Amkor Technology, Inc., and Microchip Technology Inc., St Amand has left an indelible mark on the semiconductor community. As he continues to push boundaries and explore new frontiers, it is no wonder that the name Roger D St Amand is synonymous with ingenuity and excellence in the world of innovation.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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