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Singapore, Singapore

Amkor Technology Singapore Holding Pte. Ltd.

USPTO Granted Patents = 291

Forward Citations = 136

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306 inventors (with patents filed for the assignee):

Byong Jin Kim (25 out of 66 patents)

Tae Yong Lee (25 out of 37 patents)

Ji Young Chung (24 out of 56 patents)

4. Won Chul Do (24 out of 66 patents)

5. Jin Young Khim (22 out of 23 patents)

6. Ronald Patrick Huemoeller (22 out of 161 patents)

7. Kyoung Yeon Lee (20 out of 27 patents)

8. Jin Seong Kim (18 out of 63 patents)

9. Jae Min Bae (17 out of 30 patents)

10. Gi Jeong Kim (17 out of 41 patents)

11. Ji Yeon Ryu (16 out of 25 patents)

12. Curtis Michael Zwenger (16 out of 48 patents)

13. Dong Joo Park (15 out of 27 patents)

14. Doo Hyun Park (15 out of 64 patents)

15. Shaun Bowers (14 out of 15 patents)

Core Competencies:

Electronic Devices

Semiconductor Devices

EMI Shielding

Fingerprint Sensors

Chip Scale Packages

Laser-Assisted Bonding

Coreless Signal Distribution

Package-On-Package

Floating Pads

Self-Alignment Features

Heat Sink Integration

Routing Patch

291 patents: Sort by Forward Citations

1. 12519052 - Electronic devices and methods of manufacturing electronic devices (2026-01-06),

2. 12500199 - Semiconductor device and manufacturing method thereof (2025-12-16),

3. 12500170 - Semiconductor devices with oxidized barriers (2025-12-16),

4. 12494414 - Semiconductor device with through-mold via (2025-12-09),

5. 12489101 - Electronic devices having inner electronic component interposed between substrates and method of manufacturing the same (2025-12-02),

6. 12480828 - Electronic devices and methods of manufacturing electronic devices (2025-11-25),

7. 12476171 - Land structure for semiconductor package and method therefor (2025-11-18),

8. 12464669 - Electronic devices and methods of manufacturing electronic devices (2025-11-04),

9. 12451441 - Semiconductor device having EMI shielding structure and related methods (2025-10-21),

10. 12444690 - Semiconductor devices and methods of manufacturing semiconductor devices (2025-10-14),

11. 12444669 - Semiconductor devices with floating pad and their methods of manufacturing (2025-10-14),

12. 12438124 - Semiconductor package with routing patch and method of fabricating the semiconductor package (2025-10-07),

13. 12438110 - Fingerprint sensor and manufacturing method thereof (2025-10-07),

14. 12438067 - Flip chip self-alignment features for substrate and leadframe applications and method of manufacturing the flip chip self-alignment features (2025-10-07),

15. 12431611 - Semiconductor devices and methods of manufacturing semiconductor devices (2025-09-30),

Amkor Technology Singapore Holding Pte. Ltd. is a leading provider of semiconductor packaging and test services. With its headquarters in Singapore, Amkor Technology is a global company that specializes in advanced packaging solutions for various industries including automotive, consumer electronics, and mobile communications. They offer a wide range of services such as wafer probing, packaging design, assembly, and testing. Amkor Technology Singapore Holding Pte. Ltd. has extensive experience and expertise in delivering high-quality and cost-effective packaging solutions to meet the ever-changing demands of the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

291 Patents

#20 in Singapore

#20 in Singapore

#2,969 in the World

Singapore, Singapore

Amkor Technology Singapore Holding Pte. Ltd.

Forward Citations = 136

306 inventors:

Byong Jin Kim (25 out of 66 patents)

Tae Yong Lee (25 out of 37 patents)

Ji Young Chung (24 out of 56 patents)

4. Won Chul Do (24 out of 66 patents)

5. Jin Young Khim (22 out of 23 patents)

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