The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Nov. 27, 2022
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Valley Point, SG;

Inventors:

Sang Hyeon Lee, Incheon, KR;

Kyoung Yeon Lee, Incheon, KR;

Jae Beom Shim, Incheon, KR;

Yi Seul Han, Incheon, KR;

Ji Yeon Ryu, Incheon, KR;

Woo Jun Kim, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G02B 6/42 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G02B 6/4257 (2013.01); G02B 6/426 (2013.01); G02B 6/4262 (2013.01); G02B 6/428 (2013.01); H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/182 (2013.01);
Abstract

In one example, an electronic device includes a first substrate and a second substrate. The first substrate includes a substrate first side, a substrate second side, and a first conductive structure. An inner electronic component is coupled to the first conductive structure proximate to the substrate second side. An outer electronic component is coupled to the first conductive structure proximate to the substrate first side. The outer electronic component includes a body and a groove in the body configured to couple with an external interconnect. Inner interconnects couple the first substrate to the second substrate. The first substrate, the second substrate, the inner electronic component, and the outer electronic component are in a stacked configuration. The inner electronic component is interposed between the first substrate and the second substrate. Other examples and related methods are also disclosed herein.


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