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Ji Young Chung

This inventor holds 56 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Amkor Technology, Inc., Amkor Technology Singapore Holding Pte. Ltd., Amorepacific Corporation. Active years: 2005-2025.

USPTO Granted Patents = 56 (Patent Applications = 9)

% Patents Active = 92.9

Average Co-Inventor Count = 4.4

ph-index = 5

Forward Citations = 175(Granted Patents)

Forward Citations (Not Self Cited) = 161(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Kyounggi-do, KR (2005 - 2006)
Kyeonggi-do, KR (2007)
Kyunggi-do, KR (2010)
Seoul, KR (2010)
Gunpo-si, KR (2010 - 2014)
Seongnam-si, KR (2014 - 2024)
Gyeonggi-do, KR (2015 - 2024)

Company Filing History:

30 out of 1,009

Amkor Technology, Inc.

patents

24 out of 329

Amkor Technology Singapore Holding Pte. Ltd.

patents

2 out of 559

Amorepacific Corporation

patents

Years Active: 2005-2025

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Areas of Expertise:

Semiconductor Package

Fingerprint Sensor

Electronic Device

Manufacturing Method

Redistribution Layers

Molded Substrate

Sensor Package

Dummy Substrates

Microfluidic Sensor

Conductive Patterns

Insulated Substrate

Extended Substrate

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12476171 - Land structure for semiconductor package and method therefor (2025-11-18),

2. 12438110 - Fingerprint sensor and manufacturing method thereof (2025-10-07),

3. 12388032 - Semiconductor device with redistribution layers formed utilizing dummy substrates (2025-08-12),

4. 12237239 - Semiconductor device and manufacturing method thereof (2025-02-25),

5. 12176443 - Electronic sensor devices and methods of manufacturing electronic sensor devices (2024-12-24),

6. 12107035 - Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate (2024-10-01),

7. 12033946 - Semiconductor devices and methods of manufacturing semiconductor devices (2024-07-09),

8. 12002725 - Sensor package and manufacturing method thereof (2024-06-04),

9. 11990435 - Fingerprint sensor and manufacturing method thereof (2024-05-21),

10. 11961794 - Method of forming a molded substrate electronic package and structure (2024-04-16),

11. 11908779 - Land structure for semiconductor package and method therefor (2024-02-20),

12. 11682598 - Sensor package and manufacturing method thereof (2023-06-20),

13. 11600582 - Semiconductor device with redistribution layers formed utilizing dummy substrates (2023-03-07),

14. 11594512 - Method of manufacturing an electronic device and electronic device manufactured thereby (2023-02-28),

15. 11437526 - Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices (2022-09-06),

Title: The Innovative Journey of Inventor Ji Young Chung

Introduction: Ji Young Chung, a visionary inventor hailing from Gyeonggi-do, South Korea, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Ji Young Chung's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles, a revolutionary medical device for early disease detection, and a sustainable energy solution for urban environments.

Career Highlights: With over two decades of experience in research and development, Ji Young Chung has worked for leading tech companies in South Korea, honing his skills in innovation and problem-solving. He has been recognized with multiple awards for his inventive spirit and dedication to advancing technology.

Collaborations: Throughout his career, Ji Young Chung has collaborated with top researchers, engineers, and scientists both locally and internationally. His ability to work in multidisciplinary teams has led to the successful development of innovative products that have positively impacted society.

Conclusion: Ji Young Chung's passion for innovation and his relentless drive to push the boundaries of technology make him a true pioneer in the world of inventions. His contributions continue to inspire the next generation of inventors and shape the future of technological advancements.

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