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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11682598 B1

PDFFull Text
Date of Patent:
Jun. 20, 2023

Filed:

Nov. 16, 2021

Sensor package and manufacturing method thereof

Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Ji Young Chung, Seongnam-si, KR;

Dong Joo Park, Incheon, KR;

Jin Seong Kim, Goyang-si, KR;

Jae Sung Park, Paju-si, KR;

Se Hwan Hong, Seoul, KR;

Assignee:

Amkor Technology Singapore Holding Pte., Singapore, SG;

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Manuchehr Rahmjoo

Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/00 (2006.01); G06V 40/13 (2022.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); G06V 40/1329 (2022.01); H01L 24/48 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/4952 (2013.01); H01L 23/49805 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48165 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48992 (2013.01); H01L 2224/48997 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01);
Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

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