Dong Joo Park

This inventor holds 28 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Devices. Top assignees: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology, Inc., Ericsson-Lg Co., Ltd.. Active years: 2012-2026.

USPTO Granted Patents = 28 (Patent Applications = 12)

% Patents Active = 92.9

Average Co-Inventor Count = 6.0

ph-index = 6

Forward Citations = 205(Granted Patents)

Location History:

Gangseo-gu, KR (2012)
Seongnam-si, KR (2013)
Gyeonggi-do, KR (2015 - 2023)
Incheon, KR (2013 - 2024)
Seoul, KR (2020 - 2024)

Company Filing History:

16 out of 329

Amkor Technology Singapore Holding Pte. Ltd.

patents

10 out of 1,009

Amkor Technology, Inc.

patents

1 out of 3

Ericsson-Lg Co., Ltd.

patents

4. 1 out of 22

Lg-Ericsson Co., Ltd.

patents

Years Active: 2012-2026

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Areas of Expertise:

Semiconductor Devices

Through-Mold Via

Sensor Package

Fingerprint Sensor

Manufacturing Method

Embedded Die

Overlapped Via Apertures

Stacked Package

RACH Signal

Leadframe

3D Packaging

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12581975 - Semiconductor devices and related methods (2026-03-17),

2. 12494414 - Semiconductor device with through-mold via (2025-12-09),

3. 12356777 - Semiconductor devices and methods of manufacturing semiconductor devices (2025-07-08),

4. 12107035 - Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate (2024-10-01),

5. 12002725 - Sensor package and manufacturing method thereof (2024-06-04),

6. 11996369 - Semiconductor devices and methods of manufacturing semiconductor devices (2024-05-28),

7. 11961775 - Semiconductor devices and related methods (2024-04-16),

8. 11869829 - Semiconductor device with through-mold via (2024-01-09),

9. 11682598 - Sensor package and manufacturing method thereof (2023-06-20),

10. 11545604 - Semiconductor devices and methods of manufacturing semiconductor devices (2023-01-03),

11. 11495505 - Semiconductor devices and related methods (2022-11-08),

12. 11482496 - Semiconductor devices and methods of manufacturing semiconductor devices (2022-10-25),

13. 11430723 - Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate (2022-08-30),

14. 11398455 - Semiconductor devices and related methods (2022-07-26),

15. 11177187 - Sensor package and manufacturing method thereof (2021-11-16),

Title: Dong Joo Park: Innovator from Gyeonggi-do, KR

Introduction: Dong Joo Park is a renowned inventor hailing from Gyeonggi-do, South Korea, known for his groundbreaking contributions to various fields of innovation.

Latest Patents: Dong Joo Park holds several patents in the areas of technology and healthcare, showcasing his diverse range of expertise and innovative mindset.

Career Highlights: With a career spanning over two decades, Dong Joo Park has worked tirelessly to develop cutting-edge solutions that have significantly impacted industries worldwide.

Collaborations: Throughout his career, Dong Joo Park has collaborated with leading research institutions, universities, and companies to bring his inventions to life and make a lasting impact on society.

Conclusion: Dong Joo Park's passion for innovation and his dedication to pushing the boundaries of what is possible make him a true pioneer in the world of inventions.