Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Amorepacific Corporation

Ji Young Chung

Byong Jin Kim

Gi Jeong Kim

Jae Min Bae

Jin Seong Kim

Dong Joo Park

Ju Hoon Yoon

Yoon Joo Kim

Hyung Il Jeon

Won Bae Bang

Se Hwan Hong

Jae Sung Park

Choon Heung Lee

Christopher J Berry

Kyoung Yeon Lee

Bong Chan Kim

Do Hyun Na

Sung Sun Park

Jae Yun Kim

Jin Young Kim

Doo Hyun Park

Jae Ho Lee

Tae Yong Lee

Jin Young Khim

Gi Tae Lim

Tae Kyeong Hwang

Gyu Wan Han

Byong Woo Cho

Woon Kab Jung

Ho Jeong Lim

Dae Gon Kim

Kwangmo Chris Lim

Kwang Woong Ahn

Hwan Kyu Kim

Han Bit Kim

Do Hyung Kim

Duck Hee Kim

Jun Seong Park

Dong Hyun Kim

No Sun Park

Min Kyun Yoo

Ron Huemoeller

In Bae Park

Hye Yoon Park

Sang Hyun Ryu

Jae Kyoung Lee

Jae Kyu Song

Eun Jeong Moon

In Tae Kim

Sung Chul Ha

Sung Min Lee

Tae Seong Kim

Do Hyeong Kim

Sung Hwan Yang

Chan Yeok Park

Seung Chul Jang

Glenn A Rinne

Jae Ung Lee

Yung Woo Lee

Chan Ha Hwang

Seok Ho Na

Tae Ki Kim

Byong Il Heo

Hyung Ii Jeon

A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Land structure for semiconductor package and method therefor

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

Fingerprint sensor and manufacturing method thereof

A semiconductor device with redistribution layers formed utilizing dummy substrates is disclosed and may include forming a first redistribution layer on a first dummy substrate, forming a second redistribution layer on a second dummy substrate, electrically connecting a semiconductor die to the first redistribution layer, electrically connecting the first redistribution layer to the second redistribution layer, and removing the dummy substrates. The first redistribution layer may be electrically connected to the second redistribution layer utilizing a conductive pillar. An encapsulant material may be formed between the first and second redistribution layers. Side portions of one of the first and second redistribution layers may be covered with encapsulant. A surface of the semiconductor die may be in contact with the second redistribution layer. The dummy substrates may be in panel form. One of the dummy substrates may be in panel form and the other in unit form.

Semiconductor device with redistribution layers formed utilizing dummy substrates

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.

Semiconductor device and manufacturing method thereof

In one example, an electronic device includes: an electronic component comprising a sensor and an electrical interconnect; a substrate comprising an electrically conductive material and a translucent mold compound, wherein the electrically conductive material is coupled to the translucent mold compound and wherein the electrical interconnect of the electronic component is coupled to the electrically conductive material of the substrate; and a translucent underfill contacting the electrical interconnect and between the translucent mold compound and the sensor. Other examples and related methods are also disclosed herein.

Electronic sensor devices and methods of manufacturing electronic sensor devices

A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

In one example, an electronic assembly comprises a first semiconductor device and a second semiconductor device. Each of the first semiconductor device and the second semiconductor devices comprises a substrate comprising a top surface and a conductive structure, an electronic component over the top surface of the substrate, a dielectric material over the top surface of the substrate and contacting a side of the electronic component, a substrate tab at an end of substrate and not covered by the dielectric material, wherein the conductive structure of the substrate is exposed at the substrate tab, and an interconnect electrically coupled to the conductive structure at the substrate tab of the first semiconductor device and the conductive structure at the substrate tab of the second semiconductor device. Other examples and related methods are also disclosed herein.

Semiconductor devices and methods of manufacturing semiconductor devices

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.

Sensor package and manufacturing method thereof

An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.

Method of forming a molded substrate electronic package and structure

Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Method of manufacturing an electronic device and electronic device manufactured thereby

Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices

Growing community of inventors

Gyeonggi-do, South Korea

Ji Young Chung