The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Mar. 08, 2021
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Inventors:
Hwan Kyu Kim, Incheon, KR;
Dae Gon Kim, Hwaseong-si, KR;
Tae Kyeong Hwang, Seoul, KR;
Ji Young Chung, Seongnam-si, KR;
Kwangmo Chris Lim, Seoul, KR;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/78 (2013.01); H01L 23/49866 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/94 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/8102 (2013.01); H01L 2224/81022 (2013.01); H01L 2224/8181 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2225/06513 (2013.01);
Abstract
Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.