Gilbert, AZ, United States of America

Thomas P Glenn


Average Co-Inventor Count = 1.7

ph-index = 47

Forward Citations = 7,102(Granted Patents)


Inventors with similar research interests:


Location History:

  • Phoenix, AZ (US) (1996)
  • late of Gilbert, AZ (US) (2004)
  • Gilbert, AZ (US) (1997 - 2015)

Company Filing History:


Years Active: 1996-2015

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134 patents (USPTO):

Title: Thomas P Glenn - Innovating Integrated Circuit Packaging

Introduction:

Thomas P Glenn, a prolific inventor hailing from Gilbert, AZ, has made a significant contribution to the field of integrated circuit packaging. With a total of 134 patents to his name, Glenn's expertise lies in developing novel packaging solutions for integrated circuit dies. This article explores his latest patents, career highlights, collaborations, and his invaluable contributions to the industry.

Latest Patents:

Among Glenn's recent patents is an innovative solution called "Integrated Circuit Package and Method of Making the Same." This invention introduces packages for integrated circuit dies with unique features, such as reentrant portions and asperities, which help engage the encapsulant more effectively. The method involves using a metal leadframe with a die pad and tabs, allowing for efficient attachment and electrical connection of the die. The resulting package demonstrates enhanced performance and reliability.

Career Highlights:

Throughout his career, Glenn has made a significant impact with his inventive packaging solutions. He has been associated with leading companies in the semiconductor industry, such as Amkor Technology, Inc. (formerly known as Amkor Electronics, Inc.). His exceptional skills and expertise have propelled him to the forefront of the industry, earning him a reputation as an outstanding innovator.

Collaborations:

Glenn has not only excelled individually but also collaborated with esteemed professionals in his field. Notable coworkers include Steven Webster and Roy Dale Hollaway, who have contributed significantly to the development of integrated circuit packaging technologies. Their combined expertise and collaboration have resulted in groundbreaking solutions, making a lasting impact on the industry.

Conclusion:

Thomas P Glenn's remarkable contributions to the field of integrated circuit packaging have revolutionized the industry. With numerous patents to his name, including the latest invention of an innovative integrated circuit package, Glenn's work showcases his commitment to advancing packaging technologies. His career highlights, collaborations, and invaluable contributions have solidified his position as a leading figure in the industry, inspiring future innovations and breakthroughs.

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