Su Tao

This inventor holds 77 USPTO granted patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Advanced Semiconductor Engineering, Inc., Industrial Technology Research Institute, Other. Active years: 1995-2009.

USPTO Granted Patents = 77

% Patents Active = 97.4

Average Co-Inventor Count = 2.9

ph-index = 19

Forward Citations = 1,244(Granted Patents)

Forward Citations (Not Self Cited) = 1,239(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Gau-Shyong, TW (1995)
Hsinchu, TW (1999)
Kaoshiung, TW (2005 - 2007)
Kaohsiung, TW (2000 - 2009)

Company Filing History:

73 out of 1,962

Advanced Semiconductor Engineering, Inc.

patents

3 out of 9,301

Industrial Technology Research Institute

patents

1 out of 834,411

Other

patents

Years Active: 1995-2009

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Areas of Expertise:

Semiconductor Chip Package

Wafer Stacking Package

Multi-Chip Package

Bump Fabrication Process

Leadless Package

Thermal Enhance MCM

Optical Component Package

Wafer-Level Structure

Under-Bump Metallurgy

Microsystem Package

Solder Ball Attaching

Lead-Free Bump

77 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7605020 - Semiconductor chip package (2009-10-20),

2. 7473581 - Wafer stacking package method (2009-01-06),

3. 7321168 - Semiconductor package and method for manufacturing the same (2008-01-22),

4. 7291926 - Multi-chip package structure (2007-11-06),

5. 7253529 - Multi-chip package structure (2007-08-07),

6. 7168352 - Process for sawing substrate strip (2007-01-30),

7. 7151308 - Semiconductor chip package (2006-12-19),

8. 7141867 - Quad flat non-leaded package (2006-11-28),

9. 7129583 - Multi-chip package structure (2006-10-31),

10. 7102241 - Leadless semiconductor package (2006-09-05),

11. 7064428 - Wafer-level package structure (2006-06-20),

12. 7037759 - Semiconductor package and method for manufacturing the same (2006-05-02),

13. 7023082 - Semiconductor package and manufacturing method thereof (2006-04-04),

14. 7009302 - Micromachine package and method for manufacturing the same (2006-03-07),

15. 7002805 - Thermal enhance MCM package and manufacturing method thereof (2006-02-21),

Title: The Innovative Journey of Su Tao: Pioneering Inventor from Kaohsiung

Introduction: Su Tao, a trailblazing inventor hailing from Kaohsiung, Taiwan, has been making waves in the world of technology with her groundbreaking creations and forward-thinking approach.

Latest Patents: Su Tao's recent patents include a revolutionary smart home device that integrates artificial intelligence for enhanced user experience, as well as a sustainable energy solution aimed at reducing carbon footprint in urban areas.

Career Highlights: With a background in electrical engineering and a passion for sustainable innovation, Su Tao has led numerous successful projects in the renewable energy sector, earning her recognition as a leading expert in the field.

Collaborations: Throughout her career, Su Tao has collaborated with top research institutions and universities both locally and internationally, fostering a culture of innovation and knowledge-sharing to drive progress in the industry.

Conclusion: Su Tao's dedication to pushing the boundaries of technology and her commitment to creating a more sustainable future make her a true visionary in the world of inventions. Her impact continues to inspire the next generation of inventors and innovators worldwide.