The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2009
Filed:
Dec. 18, 2006
Su Tao, Kaohsiung, TW;
Shih Chang Lee, Kaohsiung County, TW;
Su Tao, Kaohsiung, TW;
Shih Chang Lee, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A method of manufacturing a semiconductor chip package includes mechanically and electrically connecting a semiconductor chip to a top surface of a main substrate, securely attaching the semiconductor chip to a recessed cavity on a bottom surface of an interconnection substrate, mechanically and electrically connecting the main substrate to the interconnection substrate, and cutting the main substrate to form a central substrate and a peripheral substrate wherein the semiconductor chip is disposed on the central substrate. The cutting step is conducted either (i) by forming a plurality of slots such that the central substrate and the peripheral substrate are partially conned to each other or (ii) by completely separating the central substrate and the peripheral substrate.