The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Aug. 31, 2004
Applicant:
Su Tao, Kaohsiung, TW;
Inventor:
Su Tao, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A leadless semiconductor package disposed on a substrate includes a chip, a plurality of leads, wherein each lead has a metal layer and a first molding compound formed on the metal layer, a second molding compound disposed on the first molding compound, and a chip paddle for carrying the chip. The leads are connected to the chip by wire bonding technique. The metal layer is exposed out of the first molding compound; and the second molding compound encapsulates the chip with the chip paddle exposed out of the second molding compound.