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Chandler, AZ, United States of America

Amkor Electronics, Inc.

Calculating rank

USPTO Granted Patents = 40

Trademarks = 4

Forward Citations = 2,188

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35 inventors (with patents filed for the assignee):

Robert C Marrs (11 out of 13 patents)

Young Wook Heo (6 out of 16 patents)

Il Kwon Shim (5 out of 9 patents)

4. William H Maslakow (3 out of 15 patents)

5. Thomas P Glenn (3 out of 134 patents)

6. Won Sun Shin (3 out of 14 patents)

7. Tadashi Hirakawa (3 out of 14 patents)

8. Frank J Johnson (3 out of 3 patents)

9. John R McMillan (3 out of 3 patents)

10. Roy D Hollaway (2 out of 11 patents)

11. Ronald J Molnar (2 out of 2 patents)

12. Seong Min Seo (1 out of 29 patents)

13. Abram M Castro (1 out of 38 patents)

14. Roy D Holloway (1 out of 3 patents)

15. Hee Yeoul Yoo (1 out of 7 patents)

Core Competencies:

Semiconductor Package

Chip Scale Package

Heat Sink

Ball Grid Array

Thermal Dissipation

Lead Frame

Integrated Circuit

Wire Bond

Molded Package

Thermal Conductor

Flux Application

Nanocomposite

40 patents: Sort by Forward Citations

1. 5986334 - Semiconductor package having light, thin, simple and compact structure (1999-11-16),

2. 5915169 - Semiconductor chip scale package and method of producing such (1999-06-22),

3. 5894008 - Method for manufacturing an alumina-silicon carbide nanocomposite (1999-04-13),

4. 5854741 - Unit printed circuit board carrier frame for ball grid array (1998-12-29),

5. 5838951 - Wafer map conversion method (1998-11-17),

6. 5829988 - Socket assembly for integrated circuit chip carrier package (1998-11-03),

7. 5827999 - Homogeneous chip carrier package (1998-10-27),

8. 5807768 - Method for fabricating a heat sink-integrated semiconductor package (1998-09-15),

9. 5767446 - Printed circuit board having epoxy barrier around a throughout slot and (1998-06-16),

10. 5740956 - Bonding method for semiconductor chips (1998-04-21),

11. 5729432 - Ball grid array semiconductor package with improved heat dissipation and (1998-03-17),

12. 5723899 - Semiconductor lead frame having connection bar and guide rings (1998-03-03),

13. 5722161 - Method of making a packaged semiconductor die including heat sink with (1998-03-03),

14. 5712570 - Method for checking a wire bond of a semiconductor package (1998-01-27),

15. 5708567 - Ball grid array semiconductor package with ring-type heat sink (1998-01-13),

Company Overview

Amkor Electronics, Inc. is a leading provider of semiconductor packaging and test services, specializing in advanced packaging technologies. The company focuses on innovative solutions such as Chip Scale Packages, Ball Grid Arrays, and integrated circuit packages, catering to the evolving needs of the semiconductor industry. Headquartered in Chandler, Arizona, Amkor is committed to enhancing thermal management and reliability through its expertise in materials like alumina-silicon carbide nanocomposites and heat sink integration.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

40 Patents

#11 in Chandler, AZ

#97 in Arizona

#8,637 in US

#17,098 in the World

Chandler, AZ, United States of America

Amkor Electronics, Inc.

Forward Citations = 2,188

35 inventors:

Robert C Marrs (11 out of 13 patents)

Young Wook Heo (6 out of 16 patents)

Il Kwon Shim (5 out of 9 patents)

4. William H Maslakow (3 out of 15 patents)

5. Thomas P Glenn (3 out of 134 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Amkor Electronics, Inc.. Retrieved from https://idiyas.com/company/amkor-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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