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For the Inventor, By the Inventor

West Chester, PA, United States of America

Amkor Electronics, Inc.


USPTO Granted Patents = 40

Trademarks = 4

Forward Citations = 2,177

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35 inventors (with patents filed for the assignee):

goldMedal Robert C Marrs (11 out of 13 patents)

silverMedal Young Wook Heo (6 out of 16 patents)

bronzeMedal Il Kwon Shim (5 out of 9 patents)

4.  William H Maslakow (3 out of 15 patents)

5.  Thomas P Glenn (3 out of 134 patents)

6.  Won Sun Shin (3 out of 14 patents)

7.  Tadashi Hirakawa (3 out of 14 patents)

8.  Frank J Johnson (3 out of 3 patents)

9.  John R McMillan (3 out of 3 patents)

10.  Roy D Hollaway (2 out of 11 patents)

11.  Ronald J Molnar (2 out of 2 patents)

12.  Seong Min Seo (1 out of 29 patents)

13.  Abram M Castro (1 out of 38 patents)

14.  Roy D Holloway (1 out of 3 patents)

15.  Hee Yeoul Yoo (1 out of 7 patents)


Core Competencies:
Semiconductor Package
Chip Scale Package
Alumina-Silicon Carbide Nanocomposite
Ball Grid Array
Heat Sink Integration
Wire Bond Checking
Thermal Dissipator
Integrated Circuit Package
Lead Frame Construction
Thermally Enhanced Package
Molded Package
Solder Ball Leveling

40 patents:

1. 5986334 - Semiconductor package having light, thin, simple and compact structure (1999-11-16),
2. 5915169 - Semiconductor chip scale package and method of producing such (1999-06-22),
3. 5894008 - Method for manufacturing an alumina-silicon carbide nanocomposite (1999-04-13),
4. 5854741 - Unit printed circuit board carrier frame for ball grid array (1998-12-29),
5. 5838951 - Wafer map conversion method (1998-11-17),
6. 5829988 - Socket assembly for integrated circuit chip carrier package (1998-11-03),
7. 5827999 - Homogeneous chip carrier package (1998-10-27),
8. 5807768 - Method for fabricating a heat sink-integrated semiconductor package (1998-09-15),
9. 5767446 - Printed circuit board having epoxy barrier around a throughout slot and (1998-06-16),
10. 5740956 - Bonding method for semiconductor chips (1998-04-21),
11. 5729432 - Ball grid array semiconductor package with improved heat dissipation and (1998-03-17),
12. 5723899 - Semiconductor lead frame having connection bar and guide rings (1998-03-03),
13. 5722161 - Method of making a packaged semiconductor die including heat sink with (1998-03-03),
14. 5712570 - Method for checking a wire bond of a semiconductor package (1998-01-27),
15. 5708567 - Ball grid array semiconductor package with ring-type heat sink (1998-01-13),
Amkor is one of the world's largest providers of contract semiconductor assembly and test services. Headquartered in Tempe, Arizona, the company offers a wide range of advanced packaging and testing solutions to the global electronics industry. With expertise in design, product engineering, manufacturing, and more, Amkor helps customers bring their innovations to market quickly and efficiently. Through strategic collaborations and technology investments, Amkor continuously strives to stay at the forefront of the semiconductor industry.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

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40 Patents

#5 in West Chester, PA

#314 in Pennsylvania

#8,351 in US

#16,570 in the World

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West Chester, PA, United States of America

Amkor Electronics, Inc.

Forward Citations = 2,177

35 inventors:

goldMedal Robert C Marrs (11 out of 13 patents)

silverMedal Young Wook Heo (6 out of 16 patents)

bronzeMedal Il Kwon Shim (5 out of 9 patents)

4.  William H Maslakow (3 out of 15 patents)

5.  Thomas P Glenn (3 out of 134 patents)

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