The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 1999
Filed:
Dec. 23, 1996
Young Wook Heo, Seoul, KR;
Anam Industrial Co., Ltd., Seoul, KR;
Amkor Electronics, Inc., Seoul, KR;
Abstract
A semiconductor chip scale package and method of producing the package are disclosed. The package has a semiconductor chip having signal leading bumps. A PCB is electrically connected to the chip, thus transmitting input and output signals. A plurality of solder balls are formed on the lower surface of the PCB and are used as signal input and output terminals. An epoxy resin layer bonds the chip to the PCB. The PCB consists of a polymer resin substrate, a copper circuit pattern and a solder mask. The copper circuit pattern has a chip bump land and a solder ball land. The lands electrically connect the signal leading bumps to the solder balls. The package has a package size being similar to or slightly larger than a semiconductor chip within 120 % of the size of the chip.