This inventor holds 11 USPTO granted patents. Top assignees: Amkor Technology, Inc., Amkor Electronics, Inc., Ankor Technology, Inc.. Active years: 1996-2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Metro Manila, PH (1996)
- Paranaque, M.M., PH (1998)
- Paranaque, PA (1999)
- Paranaque, PH (1997 - 2001)
- Paranague, PH (2005)
Company Filing History:
8 out of 1,009 
2 out of 40 
1 out of 2 Years Active: 1996-2005
Title: The Innovative Contributions of Roy D. Hollaway
Introduction
Roy D. Hollaway is a notable inventor based in Paranaque, Philippines, recognized for his significant contributions to the field of integrated circuit packaging. With a total of 11 patents to his name, Hollaway has made remarkable advancements that have influenced the semiconductor industry.
Latest Patents
Hollaway's latest patents include a method of making near chip size integrated circuit packages. This innovative approach involves fabricating multiple integrated circuit chip packages simultaneously from a single insulating substrate. Each section of the substrate has an IC chip attached, with bonding pads electrically connected to metallizations on the substrate's surface. The encapsulation process ensures that the IC chips are protected while interconnection pads are formed for electrical connectivity.
Another significant patent is for chip-size semiconductor packages. This wafer-level method allows for mass production of various semiconductor packages, including ball grid arrays and lead-less chip carriers. By attaching ceramic substrates to the active surface of chips while they remain part of the semiconductor wafer, Hollaway's method reduces manufacturing costs and improves heat transfer, resulting in packages that are less prone to thermal-induced stresses.
Career Highlights
Throughout his career, Hollaway has worked with prominent companies such as Amkor Technology, Inc. and Amkor Electronics, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor packaging.
Collaborations
Hollaway has collaborated with notable professionals in the field, including Thomas P. Glenn and Anthony E. Panczak. These partnerships have further enhanced his work and contributed to the advancement of technology in integrated circuits.
Conclusion
Roy D. Hollaway's innovative patents and career achievements have made a lasting impact on the semiconductor industry. His work continues to influence the development of efficient and cost-effective integrated circuit packaging solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile