Amkor Technology, Inc.

Amkor Electronics, Inc.

Ankor Technology, Inc.

Roy D Hollaway

Thomas P Glenn

Anthony E Panczak

Ronald J Molnar

A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a substrate first surface. The first metallizations, IC chip including bonding pads and first substrate surface are then encapsulated. Interconnection balls or pads are formed at substrate bonding locations on a substrate second surface, the interconnection pads or balls being electrically connected to corresponding first metallizations. The substrate and encapsulant are then cut along the periphery of each section to form the plurality of IC chip packages.

Method of making near chip size integrated circuit package

A wafer-level method for mass production of surface-mounting, chip-size (&ldquo;CS&rdquo;) ball grid array (&ldquo;BGA&rdquo;), land grid array (&ldquo;LGA&rdquo;), and lead-less chip carrier (&ldquo;LCC&rdquo;) semiconductor packages includes the wire-bond or flip-chip attachment of ceramic substrates to the active surface of corresponding chips while they are still integral to a semiconductor wafer, thereby reducing manufacturing costs of the packages relative to that of individually packaged chips. The substrates have a thermal coefficient of expansion (TCE) closely matching that of the underlying chip. This eliminates the need for a silicone &ldquo;interposer&rdquo; between the substrate and the chip otherwise necessary to prevent stress-related problems caused by the difference in the respective thermal expansion and contraction of the chip and substrate with changes in temperature, further reducing the cost of the packages, improving heat transfer from the chips, and resulting in a package that is relatively free of thermal-induced stresses.

Chip-size semiconductor packages

A package for an integrated circuit is described, as are methods of making the package. The package includes a substrate having a generally planar first surface on which a metal die pad is formed. An integrated circuit die is attached to the metal die pad. An adhesive head surrounds the integrated circuit die and covers the exposed periphery of the metal die pad. A generally planar lid is in a press-fitted interconnection with the bead. An adhesive material covers conductive structures on the die, such as bonding pads, to prevent corrosion. Optionally, the package has vertical peripheral sides. The methods of making the package include methods for making packages individually, or making a plurality of packages simultaneously. Where a plurality of packages are made simultaneously, integrated circuit die are placed on each of a plurality of physically-joined package substrates on a generally planar sheet of substrate material. An adhesive bead is applied around each die. In cross-section, the bead has a central peak and a shorter peak on each side of the central peak. A sheet of lid material is placed onto the beads. After the bead is hardened, individual packages are formed by cutting the substrate sheet, lid sheet, and beads.

Integrated circuit package having adhesive bead supporting planar lid above planar substrate

Near chip size integrated circuit package

Method of making integrated circuit package having adhesive bead

A package for an integrated circuit is described, as is a method of making the package. The package is comprised of a substrate having a substantially planar first surface on which an integrated circuit die is placed. An imperforate adhesive bead on the first surface of the substrate surrounds the die. A lid transparent to electromagnetic radiation such as ultraviolet light is spaced above the integrated circuit, in a press-fitted interconnection with the bead. Epoxy is a preferred material for the bead. The lid is a single-piece of flat material, such as plastic, ceramic, or glass, which can have a diagonal edge.

Integrated circuit package

A package for an integrated circuit is described, as is a method of making the package. An exemplary method of making a package for an integrated circuit die includes a first step of providing an insulating substrate having a substantially planar first surface. A conductive path extends through the substrate. Step two of the method places an integrated circuit die, such as an EEPROM or a CCD or SAW integrated circuit die, on the first surface of the substrate. Step three electrically connects the integrated circuit die to the conductive path. Step three applies an imperforate bead of a viscous adhesive material on the first surface of the substrate around the die. The bead extends to a height above the first surface of the substrate greater than the height of the integrated circuit die. Step four provides a lid having a first surface. Step five places a peripheral portion of the first surface of the lid on the bead, such that the first surface of the lid is above the first surface of the substrate and the integrated circuit die. Step six press fits the lid into the bead. Step seven hardens the bead, and thus completes the package. Epoxy is a preferred material for the bead. The lid is a single-piece of flat material, such as plastic, ceramic, or glass, which can have a diagonal edge.

Method of making an integrated circuit package

An improved interconnection ball joint for a ball grid array integrated circuit package includes a substrate base having a first surface to which an integrated circuit die is affixed, and an opposite second surface. A metallized via extends through the substrate. The via has a central hole which extends through the substrate. The hole is plugged with a flexible nonconductive material, such as epoxy solder mask material. A metallic interconnection ball land is on the second surface of the substrate, integral with the metallized via and adjacent to the hole and the plug of nonconductive material. A solder interconnection ball is formed on the land, opposite the via and the plug of nonconductive material. A metal-to-metal annular bond is formed at the joint between the interconnection ball and the land around the plug of nonconductive material in the center of the via. The joint has an unexpectedly high shearing strength, and resists cracking, which reduces risks of a electrical connectivity failure at the joint. Location of the interconnection ball directly opposite the via allows miniaturization of the package.

Solder ball joint

Two interdigitated comb-shaped fixed voltage buses such as a power bus and ground bus, in the form of metallization are provided substantially encircling of an integrated circuit die in an integrated circuit package or other integrated die assembly. Any selection of bonding pads on the die and metallization leads in the assembly may be connected to the fingers of either bus. The length of wire bond or TAB connections and the area occupied by the buses is minimized by the interdigitated geometry of the buses.

Interdigitated wirebond programmable fixed voltage planes

A method and apparatus for applying flux to a series of metallization contacts or plated contact pad a substrate exposed by an apertured solder mask, employs a compressible transfer pad. A central flux pick-up area is formed on the transfer pad bottom surface. The bottom surface may be spherical and may include a cylindrical post onto which a predetermined amount of flux is transferred, such as by dipping the pick-up area into a reservoir of semi-liquid paste flux. The transfer pad is then positioned over and compressed on the solder mask such that the picked up flux on the flux pick-up area of the transfer pad is pressure forced by compression of the transfer pad through apertures in the solder mask directly and successively into all the series of depressions formed on the substrate until all the depressions are substantially filled with flux. After breaking away and removal of the transfer pad, a solder ball or bonder applied solder is deposited in each flux-containing depression to form a metallurgical bond between the ball and a plated contact pad or package metallization such as a lead frame.

Growing community of inventors

Paranaque, Philippines

Roy D Hollaway