The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2000
Filed:
Apr. 18, 1997
Thomas P Glenn, Gilbert, AZ (US);
Roy D Hollaway, Paranaque, PH;
Anthony E Panczak, Sunnyvale, CA (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A package for an integrated circuit is described, as is a method of making the package. The package is comprised of a substrate having a substantially planar first surface on which an integrated circuit die is placed. An imperforate adhesive bead on the first surface of the substrate surrounds the die. A lid transparent to electromagnetic radiation such as ultraviolet light is spaced above the integrated circuit, in a press-fitted interconnection with the bead. Epoxy is a preferred material for the bead. The lid is a single-piece of flat material, such as plastic, ceramic, or glass, which can have a diagonal edge.