Company Filing History:

12 out of 1,586

Teijin Limited

patents

3 out of 40

Amkor Electronics, Inc.

patents

2 out of 3

Fuji Machinery Mfg. & Electronics Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 1979-2000

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6040984 - Printed circuit board with opposed bonding shelves for semiconductor (2000-03-21),

2. 6011694 - Ball grid array semiconductor package with solder ball openings in an (2000-01-04),

3. 5483100 - Integrated circuit package with via interconnections formed in a (1996-01-09),

4. 5436301 - Epoxy resin-impregnated prepreg (1995-07-25),

5. 5378869 - Method for forming an integrated circuit package with via interconnection (1995-01-03),

6. 5355283 - Ball grid array with via interconnection (1994-10-11),

7. 5240770 - Surface-modified wholly aromatic polyamide fiber and method of producing (1993-08-31),

8. 4710432 - Base material for honeycomb core structure and process for producing the (1987-12-01),

9. 4582747 - Dust-proof fabric (1986-04-15),

10. 4529481 - Synthetic polyester pulp and process for preparing same (1985-07-16),

11. 4501641 - Process for producing paper or non-woven fabric (1985-02-26),

12. 4496583 - Paper-like polyester fiber sheet and process for producing the same (1985-01-29),

13. 4225642 - Raised and fused fabric filter and process for producing the same (1980-09-30),

14. 4154881 - Antistatic composite yarn and carpet (1979-05-15),

Title: Innovations of Tadashi Hirakawa

Introduction

Tadashi Hirakawa is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on improving the efficiency and cost-effectiveness of printed circuit boards and semiconductor packaging.

Latest Patents

One of his latest patents is a printed circuit board with opposed bonding shelves for semiconductors. This innovation provides high-density bonding pads at a low cost while minimizing the difference in levels of bonding pads. The design includes conductive traces on both sides of a base material, allowing for efficient chip bonding. Another notable patent is for a ball grid array semiconductor package with solder ball openings. This package enables high pin count and density without routing issues, featuring independent circuits on both surfaces of an insulative base material.

Career Highlights

Throughout his career, Tadashi Hirakawa has worked with notable companies such as Teijin Limited and Amkor Electronics, Inc. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Tadashi has collaborated with several professionals in the field, including Robert C. Marrs and Makoto Yoshida. These collaborations have further enhanced his work and contributions to semiconductor technology.

Conclusion

Tadashi Hirakawa's innovations in semiconductor technology have made a significant impact on the industry. His patents reflect a commitment to advancing the efficiency and functionality of electronic components.

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