The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2000
Filed:
Aug. 01, 1997
Tadashi Hirakawa, Osaka, JP;
Fuji Machinery Mfg. & Electronics Co., Ltd., Osaka, JP;
Abstract
An area grid array package such as a ball grid array enables high pin count and high density with no problems of routing, and at low cost. Independent and non-connected circuits are formed on a first surface and a second surface of an insulative base material, each circuit on each surface having first chip connection pads formed on one end to connect to a semiconductor chip, the other end having second solder ball pads to mount solder balls. The chip is connected to the first connection pads by either bonding wires or connection bumps extending through holes in the base material and are molded by a resin. Each solder ball pad on each surface has a solder ball attached with the solder balls extending through openings in the base material. The insulative base material and the semiconductor chip may be attached to a heat slug.