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For the Inventor, By the Inventor

Fort Worth, TX, United States of America

Abram M Castro

USPTO Granted Patents = 38 

Average Co-Inventor Count = 1.9

ph-index = 10

Forward Citations = 389(Granted Patents)


Location History:

  • Ft. Worth, TX (US) (2009)
  • Fort Worth, TX (US) (1997 - 2023)
  • Carrollton, TX (US) (2017 - 2024)

Company Filing History:

goldMedal31 out of 29,232 
 
Texas Instruments Corporation
 patents
silverMedal5 out of 5 
 
Substrate Technologies Incorporated
 patents
bronzeMedal1 out of 40 
 
Amkor Electronics, Inc.
 patents
4. 1 out of 1 
 
Touch Future Technolocy Ltd.
 patent

Years Active: 1997-2024

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38 patents (USPTO):
1. 12087673 - QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same (2024-09-10),
2. 11854947 - Integrated circuit chip with a vertical connector (2023-12-26),
3. 11838004 - Acoustic device package and method of making (2023-12-05),
4. 11830793 - Multi-lead adapter (2023-11-28),
5. 11552005 - Integrated circuit package electronic device (2023-01-10),
6. 11495524 - QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same (2022-11-08),
7. 11177195 - Multi-lead adapter (2021-11-16),
8. 11088052 - Integrated circuit package electronic device including pillar contacts and electrical terminations (2021-08-10),
9. 10804185 - Integrated circuit chip with a vertical connector (2020-10-13),
10. 10756013 - Packaged semiconductor system having unidirectional connections to discrete components (2020-08-25),
11. 10727085 - Printed adhesion deposition to mitigate integrated circuit package delamination (2020-07-28),
12. 10566276 - Packaged semiconductor system having unidirectional connections to discrete components (2020-02-18),
13. 10347508 - Printed adhesion deposition to mitigate integrated circuit delamination (2019-07-09),
14. 10284172 - Acoustic device package and method of making (2019-05-07),
15. 10199348 - Plastic-packaged semiconductor device having wires with polymerized insulating layer (2019-02-05),

Title: Innovator Spotlight: Abram M Castro - Pioneering Inventor from Fort Worth, TX

Introduction:

Abram M Castro is a prolific inventor based in Fort Worth, Texas, with an impressive track record of 38 patents to his name. His innovative spirit and commitment to advancing technology have led to groundbreaking advancements in various industries.

Latest Patents:

1. QFN device with inspectable solder joint mechanism: A unique apparatus and method designed to provide an artificial standoff to QFN device leads, enhancing solder flow dynamics and enabling inspectable solder joints when attached to printed wiring boards.

2. Integrated circuit chip with vertical connector: An inventive integrated circuit chip featuring a vertical wire that protrudes through the surface, forming a vertical connector for enhanced connectivity within IC chips.

Career Highlights:

Abram M Castro has made significant contributions to companies like Texas Instruments Corporation and Substrate Technologies Incorporated. Through his innovative ideas and problem-solving skills, he has played a pivotal role in driving technological advancements in the semiconductor industry.

Collaborations:

Throughout his career, Abram M Castro has collaborated with esteemed professionals such as Rongwei Zhang and Mark Allen Gerber. These collaborations have fostered a creative environment where groundbreaking ideas flourish and innovative solutions are brought to life.

Conclusion:

Inventor Abram M Castro's remarkable journey showcases his dedication to innovation and his invaluable contributions to the field of technology. His inventive spirit and collaborative approach continue to inspire and drive progress in the ever-evolving world of inventions and patents.

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