The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Feb. 17, 2020
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Saumya Gandhi, Irving, TX (US);

Matthew David Romig, Wylie, TX (US);

Abram Castro, Carrollton, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/31 (2006.01); H01G 4/005 (2006.01); H01L 49/02 (2006.01); H01L 25/065 (2006.01); H01L 23/522 (2006.01); H01L 23/495 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01C 1/02 (2006.01); H01G 4/224 (2006.01); H01L 23/532 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01C 1/02 (2013.01); H01G 4/005 (2013.01); H01G 4/224 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01L 23/3121 (2013.01); H01L 23/49589 (2013.01); H01L 23/5222 (2013.01); H01L 23/5328 (2013.01); H01L 25/0657 (2013.01); H01L 28/60 (2013.01); H01L 23/145 (2013.01); H01L 23/3107 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32265 (2013.01); H01L 2224/40195 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.


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