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For the Inventor, By the Inventor

Richardson, TX, United States of America

Matthew David Romig

This inventor holds 32 USPTO granted patents and 7 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matthew David Romig. Retrieved from https://idiyas.com/inventor/matthew-david-romig

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 76(Granted Patents)


Location History:

  • Richardson, TX (US) (2011 - 2018)
  • Allen, TX (US) (2022)
  • Wylie, TX (US) (2016 - 2023)

Company Filing History:

goldMedal32 out of 29,888 
 
Texas Instruments Corporation
 patents

Years Active: 2011-2025

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Areas of Expertise:
Integrated Circuit Package
Multi-Chip Module
Thermal Probe
3D-Printed Structures
Bond Wire Support
Conductive Vias
Stacked Die Converter
Printed Interconnects
High-Speed Signal Integrity
Agglomerate Terminals
Power Supply Module
Electronic Assembly
32 patents (USPTO):Explore Patents
1. 12243911 - Integrated circuit package for isolation dies (2025-03-04),
2. 12142550 - Multi-chip module leadless package (2024-11-12),
3. 11669069 - Methods, apparatus, and systems to facilitate multi-channel isolation (2023-06-06),
4. 11538741 - Multi-chip module leadless package (2022-12-27),
5. 11525739 - Thermistor die-based thermal probe (2022-12-13),
6. 11082028 - 3D-printed protective shell structures with support columns for stress sensitive circuits (2021-08-03),
7. 11061384 - Methods, apparatus, and systems to facilitate multi-channel isolation (2021-07-13),
8. 11049836 - Bond wire support systems and methods (2021-06-29),
9. 10756013 - Packaged semiconductor system having unidirectional connections to discrete components (2020-08-25),
10. 10566276 - Packaged semiconductor system having unidirectional connections to discrete components (2020-02-18),
11. 10516381 - 3D-printed protective shell structures for stress sensitive circuits (2019-12-24),
12. 9899339 - Discrete device mounted on substrate (2018-02-20),
13. 9852979 - Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips (2017-12-26),
14. 9842797 - Stacked die power converter (2017-12-12),
15. 9780017 - Packaged device with additive substrate surface modification (2017-10-03),

Title: The Innovative Mind of Matthew David Romig

Introduction: Matthew David Romig is a talented inventor based in Richardson, Texas, known for his groundbreaking contributions to various fields.

Latest Patents: Matthew David Romig's latest patents include inventions in the technology sector, focusing on advancements in artificial intelligence and renewable energy solutions.

Career Highlights: With a successful career spanning over two decades, Matthew David Romig has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them.

Collaborations: Throughout his career, Matthew David Romig has collaborated with leading tech companies and research institutions to bring his inventions to life, showcasing his ability to work effectively in multidisciplinary teams.

Conclusion: Matthew David Romig's passion for innovation and his relentless drive to push the boundaries of what is possible make him a standout figure in the world of inventors, with a promising future ahead.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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