Richardson, TX, United States of America

Matthew David Romig

This inventor holds 32 USPTO granted patents and 7 published patent applications and 1 EPO patent. Top assignee: Texas Instruments Corporation. Active years: 2011-2025.

USPTO Granted Patents = 32 (Patent Applications = 7)

% Patents Active = 100.0

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 76(Granted Patents)

Location History:

Richardson, TX (US) (2011 - 2018)
Allen, TX (US) (2022)
Wylie, TX (US) (2016 - 2023)

Company Filing History:

32 out of 29,845

Texas Instruments Corporation

patents

Years Active: 2011-2025

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Areas of Expertise:

Integrated Circuit Package

Multi-Chip Module

Thermistor Die

3D-Printed Structures

Bond Wire Support

Conductive Through-Polymer Vias

Stacked Die Power Converter

Printed Interconnects

High-Speed Signal Integrity

Embedded Antenna

Electronic Assembly

Uniform Current Distribution

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12243911 - Integrated circuit package for isolation dies (2025-03-04),

2. 12142550 - Multi-chip module leadless package (2024-11-12),

3. 11669069 - Methods, apparatus, and systems to facilitate multi-channel isolation (2023-06-06),

4. 11538741 - Multi-chip module leadless package (2022-12-27),

5. 11525739 - Thermistor die-based thermal probe (2022-12-13),

6. 11082028 - 3D-printed protective shell structures with support columns for stress sensitive circuits (2021-08-03),

7. 11061384 - Methods, apparatus, and systems to facilitate multi-channel isolation (2021-07-13),

8. 11049836 - Bond wire support systems and methods (2021-06-29),

9. 10756013 - Packaged semiconductor system having unidirectional connections to discrete components (2020-08-25),

10. 10566276 - Packaged semiconductor system having unidirectional connections to discrete components (2020-02-18),

11. 10516381 - 3D-printed protective shell structures for stress sensitive circuits (2019-12-24),

12. 9899339 - Discrete device mounted on substrate (2018-02-20),

13. 9852979 - Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips (2017-12-26),

14. 9842797 - Stacked die power converter (2017-12-12),

15. 9780017 - Packaged device with additive substrate surface modification (2017-10-03),

Title: The Innovative Mind of Matthew David Romig

Introduction: Matthew David Romig is a talented inventor based in Richardson, Texas, known for his groundbreaking contributions to various fields.

Latest Patents: Matthew David Romig's latest patents include inventions in the technology sector, focusing on advancements in artificial intelligence and renewable energy solutions.

Career Highlights: With a successful career spanning over two decades, Matthew David Romig has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them.

Collaborations: Throughout his career, Matthew David Romig has collaborated with leading tech companies and research institutions to bring his inventions to life, showcasing his ability to work effectively in multidisciplinary teams.

Conclusion: Matthew David Romig's passion for innovation and his relentless drive to push the boundaries of what is possible make him a standout figure in the world of inventors, with a promising future ahead.