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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9852979 B1

PDFFull Text
Date of Patent:
Dec. 26, 2017

Filed:

Oct. 31, 2016

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Matthew D. Romig, Wylie, TX (US);

Frank Stepniak, Allen, TX (US);

Saumya Gandhi, Lewisville, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Jacqueline J. Garner

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Seahvosh Nikmanesh

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 21/288 (2006.01); H01L 21/78 (2006.01); H01L 29/02 (2006.01); H01L 21/3105 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/288 (2013.01); H01L 21/31051 (2013.01); H01L 21/76805 (2013.01); H01L 21/76831 (2013.01); H01L 21/76874 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 28/60 (2013.01); H05K 1/113 (2013.01); H05K 1/162 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H01L 24/14 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic system comprising an electronic body () with terminal pads () and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film () covering the body surface except the terminal pads; a sheet () of high-density capacitive elements, the first capacitor terminal being a metal foil () attached to film (), the second terminal a conductive polymeric compound (), and the insulator a dielectric skin (). Sheet () has sets of via holes: the first set holes reaching metal foil), the second set holes reaching the terminals (), and the third set holes reaching the conductive polymeric compound (). An insulating second polymeric film () lining the sidewalls of the holes and planarizing the sheet surface; and metal () filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

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