Frank Stepniak

This inventor holds 10 USPTO granted patents and 2 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2014-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Frank Stepniak. Retrieved from https://idiyas.com/inventor/frank-stepniak

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10 (Patent Applications = 2)

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 22(Granted Patents)

Company Filing History:

10 out of 29,901

Texas Instruments Corporation

patents

Years Active: 2014-2018

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10104764 - Electronic device package with vertically integrated capacitors (2018-10-16),

2. 9899339 - Discrete device mounted on substrate (2018-02-20),

3. 9852979 - Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips (2017-12-26),

4. 9572261 - Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips (2017-02-14),

5. 9321631 - Method for embedding controlled-cavity MEMS package in integration board (2016-04-26),

6. 9111845 - Integrated circuit package with printed circuit layer (2015-08-18),

7. 8945986 - Electronic assembly with three dimensional inkjet printed traces (2015-02-03),

8. 8866237 - Methods for embedding controlled-cavity MEMS package in integration board (2014-10-21),

9. 8847349 - Integrated circuit package with printed circuit layer (2014-09-30),

10. 8816513 - Electronic assembly with three dimensional inkjet printed traces (2014-08-26),

Title: Frank Stepniak: Innovator in Electronic Device Packaging

Introduction

Frank Stepniak is a notable inventor based in Allen, TX (US), recognized for his contributions to the field of electronic device packaging. With a total of 10 patents to his name, Stepniak has made significant advancements in the integration of electronic components, enhancing the efficiency and functionality of modern devices.

Latest Patents

Among his latest innovations, Stepniak has developed an electronic device package featuring vertically integrated capacitors. This system-in-a-package (SIP) incorporates a semiconductor chip embedded in a dielectric substrate, with an inductor positioned on the top surface and connected to the chip. Additionally, thin film capacitors are strategically placed to facilitate heat dissipation, ensuring optimal performance. Another notable patent involves a method for creating an electronic device with a discrete device mounted on an electronic die. This method utilizes heat cured conductive ink to connect the discrete device and the die, while maintaining a temperature below 200° C during the process.

Career Highlights

Stepniak is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work focuses on innovative solutions that push the boundaries of electronic device design and functionality. His patents reflect a deep understanding of the complexities involved in electronic packaging and integration.

Collaborations

Throughout his career, Stepniak has collaborated with talented individuals such as Matthew David Romig and Sreenivasan Kalyani Koduri. These partnerships have contributed to the development of cutting-edge technologies in the field.

Conclusion

Frank Stepniak's contributions to electronic device packaging exemplify the spirit of innovation in the technology sector. His patents not only enhance device performance but also pave the way for future advancements in the industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: