Texas Instruments Corporation

Frank Stepniak

Matthew David Romig

Sreenivasan Kalyani Koduri

Leslie Edward Stark

Lance Cole Wright

Christopher Daniel Manack

Saumya Gandhi

Anton Winkler

Screenivasan K Koduri

A system-in-a-package (SIP) has a semiconductor chip embedded in a dielectric substrate. An inductor is on a top surface of a substrate and is connected to the semiconductor chip. A thin film capacitor may be placed between the inductor and the dielectric substrate. A second thin film capacitor may be placed on the top surface of the semiconductor chip, or be embedded in the dielectric substrate with a thermal pad on a bottom surface of the substrate which is connected to the second thin film capacitor to facilitate heat dissipation.

Electronic device package with vertically integrated capacitors

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200&#xb0; C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

Discrete device mounted on substrate

An electronic system comprising an electronic body () with terminal pads () and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film () covering the body surface except the terminal pads; a sheet () of high-density capacitive elements, the first capacitor terminal being a metal foil () attached to film (), the second terminal a conductive polymeric compound (), and the insulator a dielectric skin (). Sheet () has sets of via holes: the first set holes reaching metal foil), the second set holes reaching the terminals (), and the third set holes reaching the conductive polymeric compound (). An insulating second polymeric film () lining the sidewalls of the holes and planarizing the sheet surface; and metal () filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.

Method for embedding controlled-cavity MEMS package in integration board

An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Integrated circuit package with printed circuit layer

One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Electronic assembly with three dimensional inkjet printed traces

An embedded micro-electro-mechanical system (MEMS) () comprising a semiconductor chip () embedded in an insulating board (), the chip having a cavity () including a radiation sensor MEMS (), the opening () of the cavity at the chip surface covered by a plate () transmissive to the radiation () sensed by the MEMS. The plate surface remote from the cavity having a bare central area, to be exposed to the radiation sensed by the MEMS in the cavity, and a peripheral area covered by a metal film () touching the plate surface and a layer () of adhesive stacked on the metal film.

Growing community of inventors

Allen, TX, United States of America

Frank Stepniak