The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Aug. 26, 2014
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Matthew David Romig, Richardson, TX (US);
Lance Cole Wright, Allen, TX (US);
Leslie Edward Stark, Rowlett, TX (US);
Frank Stepniak, Allen, TX (US);
Sreenivasan K. Koduri, Allen, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H01L 23/28 (2006.01); H01L 23/522 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/28 (2013.01); H01L 23/5226 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 28/00 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15183 (2013.01); H01L 2924/15311 (2013.01); H05K 1/16 (2013.01);
Abstract
An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.