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Sreenivasan Kalyani Koduri

Allen, TX, United States of America

Sreenivasan Kalyani Koduri

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This inventor holds 134 USPTO granted patents and 36 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L21-565). Top assignee: Texas Instruments Corporation. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sreenivasan Kalyani Koduri. Retrieved from https://idiyas.com/inventor/sreenivasan-kalyani-koduri

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 134 

% Patents Active = 99.3

 

Average Co-Inventor Count = 1.6

ph-index = 7

Forward Citations = 253(Granted Patents)

Forward Citations (Not Self Cited) = 212(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Plano, TX (US) (2003 - 2011)
  • Allex, TX (US) (2020)
  • Dallas, TX (US) (1999 - 2024)
  • Allen, TX (US) (2009 - 2024)

Company Filing History:

goldMedal134 out of 29,901 
 
Texas Instruments Corporation
 patents

Years Active: 1999-2026

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Areas of Expertise:
Sensor Packages
Microelectronic Devices
Circuit Design
Bump Bonds
Integrated Circuits
Electromigration
Leadframes
Nanowires
3D Integration
Power Semiconductors
Die Attach
Mechanical Sensors
134 patents (USPTO):Explore Patents
1. 12733558 - Configurable leaded package (2026-09-08),
2. 12710385 - METAL-LINED PACKAGE CAVITY FOR FLUID SENSORS (2026-08-18),
3. 12707992 - Electronic device including vertical high current hall sensor with integrated heat slug current loop power pad (2026-08-11),
4. 12568843 - Film covers for sensor packages (2026-03-03),
5. 12506097 - Expanded head pillar for bump bonds (2025-12-23),
6. 12505268 - Automated geometry optimization for analog, mixed-signal circuit design (2025-12-23),
7. 12489067 - Industrial chip scale package for microelectronic device (2025-12-02),
8. 12419063 - Inductor on microelectronic die (2025-09-16),
9. 12400945 - Electronic device multilevel package substrate for improved electromigration performance (2025-08-26),
10. 12389730 - Integrated circuit device package (2025-08-12),
11. 12347738 - Sensor package cavities with polymer films (2025-07-01),
12. 12300678 - Package for power semiconductor devices (2025-05-13),
13. 12299364 - Multi-algorithmic approach to represent highly non-linear high dimensional space (2025-05-13),
14. 12230594 - Printed package and method of making the same (2025-02-18),
15. 12203776 - Miniature sensor cavities (2025-01-21),

Title: The Innovative Journey of Sreenivasan Kalyani Koduri

Introduction: Sreenivasan Kalyani Koduri, a talented inventor hailing from Allen, TX (US), has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Sreenivasan Kalyani Koduri's latest patents include cutting-edge solutions in the realm of artificial intelligence, renewable energy, and sustainable technologies.

Career Highlights: With a career spanning over two decades, Sreenivasan Kalyani Koduri has worked with leading tech companies, research institutions, and universities, showcasing his expertise in developing futuristic inventions.

Collaborations: Throughout his career, Sreenivasan Kalyani Koduri has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and pushing the boundaries of technological advancements.

Conclusion: Sreenivasan Kalyani Koduri's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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