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For the Inventor, By the Inventor

Sreenivasan Kalyani Koduri

Allen, TX, United States of America

Sreenivasan Kalyani Koduri

LinkedIn
USPTO Granted Patents = 130 

 

Average Co-Inventor Count = 1.6

ph-index = 7

Forward Citations = 244(Granted Patents)

Forward Citations (Not Self Cited) = 212(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Plano, TX (US) (2003 - 2011)
  • Allex, TX (US) (2020)
  • Dallas, TX (US) (1999 - 2024)
  • Allen, TX (US) (2009 - 2024)

Company Filing History:

goldMedal130 out of 29,279 
 
Texas Instruments Corporation
 patents

Years Active: 1999-2025

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Areas of Expertise:
Microelectronic Packaging
Semiconductor Devices
Sensor Technology
Three-Dimensional Integration
Nanowires
Electromigration Performance
Analog Circuit Design
Power Semiconductor Packages
Integrated Circuit Design
Lidar Imaging
Multi-Algorithmic Approaches
Die Attach Techniques
130 patents (USPTO):Explore Patents
1. 12506097 - Expanded head pillar for bump bonds (2025-12-23),
2. 12505268 - Automated geometry optimization for analog, mixed-signal circuit design (2025-12-23),
3. 12489067 - Industrial chip scale package for microelectronic device (2025-12-02),
4. 12419063 - Inductor on microelectronic die (2025-09-16),
5. 12400945 - Electronic device multilevel package substrate for improved electromigration performance (2025-08-26),
6. 12389730 - Integrated circuit device package (2025-08-12),
7. 12347738 - Sensor package cavities with polymer films (2025-07-01),
8. 12300678 - Package for power semiconductor devices (2025-05-13),
9. 12299364 - Multi-algorithmic approach to represent highly non-linear high dimensional space (2025-05-13),
10. 12230594 - Printed package and method of making the same (2025-02-18),
11. 12203776 - Miniature sensor cavities (2025-01-21),
12. 12198995 - Covers for semiconductor package components (2025-01-14),
13. 12191273 - Pre-molded leadframes in semiconductor devices (2025-01-07),
14. 12183703 - Leadframes in semiconductor devices (2024-12-31),
15. 12177988 - Wafer level bump stack for chip scale package (2024-12-24),

Title: The Innovative Journey of Sreenivasan Kalyani Koduri

Introduction: Sreenivasan Kalyani Koduri, a talented inventor hailing from Allen, TX (US), has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Sreenivasan Kalyani Koduri's latest patents include cutting-edge solutions in the realm of artificial intelligence, renewable energy, and sustainable technologies.

Career Highlights: With a career spanning over two decades, Sreenivasan Kalyani Koduri has worked with leading tech companies, research institutions, and universities, showcasing his expertise in developing futuristic inventions.

Collaborations: Throughout his career, Sreenivasan Kalyani Koduri has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and pushing the boundaries of technological advancements.

Conclusion: Sreenivasan Kalyani Koduri's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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