The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Sep. 15, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Hank Sung, Allen, TX (US);

Dok Won Lee, Mountain View, CA (US);

Wai Lee, Dallas, TX (US);

Sreenivasan Koduri, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); G01R 15/20 (2006.01); H10W 70/04 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/50 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/461 (2026.01); H10W 70/041 (2026.01); H10W 70/417 (2026.01); H10W 70/429 (2026.01); G01R 15/202 (2013.01); H10W 72/073 (2026.01); H10W 72/07338 (2026.01); H10W 72/075 (2026.01); H10W 72/354 (2026.01); H10W 72/5449 (2026.01); H10W 72/884 (2026.01); H10W 74/114 (2026.01); H10W 90/736 (2026.01); H10W 90/755 (2026.01);
Abstract

An electronic device includes a metal heat slug, a semiconductor die, and a package structure. The metal heat slug has a first portion, a second portion, and a third portion, the second portion is spaced apart from the first portion, and the third portion connects the first and second portions. The semiconductor die is attached to the third portion of the metal heat slug to measure a current of the third portion of the metal heat slug, and the package structure encloses the semiconductor die and the third portion of the metal heat slug and exposes sides of the first and second portions of the metal heat slug.


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