The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Nov. 18, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Sreenivasan Kalyani Koduri, Allen, TX (US);
Christopher Daniel Manack, Flower Mound, TX (US);
Leslie Edward Stark, Rockwall, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49503 (2013.01); H01L 23/4952 (2013.01);
Abstract
In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.