The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Nov. 05, 2012
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Matthew David Romig, Richardson, TX (US);

Lance Cole Wright, Allen, TX (US);

Leslie Edward Stark, Rowlett, TX (US);

Frank Stepniak, Allen, TX (US);

Sreenivasan K. Koduri, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/64 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/5228 (2013.01); H01L 23/5328 (2013.01); H01L 24/29 (2013.01); H01L 2224/245 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/822 (2013.01); H01L 2224/8221 (2013.01); H01L 2224/8284 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/82399 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19104 (2013.01);
Abstract

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.


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