Texas Instruments Corporation

Matthew David Romig

Frank Stepniak

Benjamin Stassen Cook

Juan Alejandro Herbsommer

Leslie Edward Stark

Lance Cole Wright

Sreenivasan Kalyani Koduri

Abram M Castro

Saumya Gandhi

Wei Zhang

Luu Thanh Nguyen

Steven Alfred Kummerl

Masood Murtuza

Wei-Yan Shih

Siva Prakash Gurrum

Darvin R Edwards

Mayank Garg

Rongwei Zhang

Yong Lin

James Cooper Wainerdi

Mohammad Waseem Hussain

Kazunori Hayata

Peter Fundaro

Alexander Harvey Scheuermann

Marie-Solange Anne Milleron

Gregory Eric Howard

Rajen Manicon Murugan

Christopher Daniel Manack

Yiqi Tang

Enis Tuncer

Tetsuo Tateishi

Brian Ashley Carpenter

Alok Kumar Lohia

Christopher John Sanzo

William Todd Harrison

Benjamin Michael Sutton

Steve Edward Harrell

Screenivasan K Koduri

Souvik Mukherjee

Steven Aldred Kummerl

In described examples of an isolation device, an isolation die that has a set of bond pads is mounted on a first lead frame that has a set of leads. A portion of the bond pads are coupled to respective leads. A first mold material encapsulates the isolation device and the first lead frame forming a first package. The first package is mounted on a second lead frame that has a set of leads. A portion of the first lead frame leads is coupled to respective ones of the second lead frame leads. A second mold material encapsulates the first package and the second lead frame.

Integrated circuit package for isolation dies

A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.

Multi-chip module leadless package

Methods, systems, and apparatus to facilitate multi-channel isolation is disclosed. An example apparatus includes a multiplexer including a first input terminal, a second input terminal, and an output terminal; a modulator including an input terminal and an output terminal, the input terminal of the modulator coupled to the output terminal of the multiplexer; an isolation capacitor including a first terminal and a second terminal, the first terminal of the isolation capacitor coupled to the output terminal of the modulator; a first receiver die coupled to the second terminal of the isolation capacitor; and a second receiver die coupled to the second terminal of the isolation capacitor.

Methods, apparatus, and systems to facilitate multi-channel isolation

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W, Wthat extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

Thermistor die-based thermal probe

In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.

3D-printed protective shell structures with support columns for stress sensitive circuits

A system includes a substrate; a bond pad; a wire spanning above the substrate, having a first end bonded to the bond pad and a second end extending from the bond pad to terminate in a second end thereof; and a support structure disposed on the substrate, the support structure comprising at least a side wall and extending from the substrate to terminate in an end portion spaced from the substrate to support the wire.

Bond wire support systems and methods

A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.

Packaged semiconductor system having unidirectional connections to discrete components

3D-printed protective shell structures for stress sensitive circuits

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200&#xb0; C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

Discrete device mounted on substrate

An electronic system comprising an electronic body () with terminal pads () and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film () covering the body surface except the terminal pads; a sheet () of high-density capacitive elements, the first capacitor terminal being a metal foil () attached to film (), the second terminal a conductive polymeric compound (), and the insulator a dielectric skin (). Sheet () has sets of via holes: the first set holes reaching metal foil), the second set holes reaching the terminals (), and the third set holes reaching the conductive polymeric compound (). An insulating second polymeric film () lining the sidewalls of the holes and planarizing the sheet surface; and metal () filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface.

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

A stacked die power converter package includes a lead frame including a die pad and a plurality of package pins, a first die including a first power transistor switch (first power transistor) attached to the die pad, and a first metal clip attached to one side of the first die. The first metal clip is coupled to at least one package pin. A second die including a second power transistor switch (second power transistor) is attached to another side on the first metal clip. A controller is provided by a controller die attached to a non-conductive layer on the second metal clip on one side of the second die.

Stacked die power converter

A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.

Packaged device with additive substrate surface modification

Growing community of inventors

Richardson, TX, United States of America

Matthew David Romig