The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Nov. 09, 2016
Texas Instruments Incorporated, Dallas, TX (US);
Benjamin Stassen Cook, Addison, TX (US);
Juan Alejandro Herbsommer, Allen, TX (US);
Yong Lin, Plano, TX (US);
Rongwei Zhang, Plano, TX (US);
Abram Castro, Carrollton, TX (US);
Matthew David Romig, Wylie, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.