The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
May. 08, 2018
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Matthew David Romig, Wylie, TX (US);
Steven Aldred Kummerl, Carrollton, TX (US);
Steve Edward Harrell, Corinth, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/10 (2006.01); G01K 1/08 (2021.01); H01C 7/00 (2006.01); G01K 7/24 (2006.01); H01C 1/01 (2006.01); H01C 1/034 (2006.01); H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
G01K 1/08 (2013.01); G01K 7/24 (2013.01); H01C 1/01 (2013.01); H01C 1/034 (2013.01); H01C 7/008 (2013.01); H01C 17/006 (2013.01);
Abstract
A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W, Wthat extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.