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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11525739 B1

PDFFull Text
Date of Patent:
Dec. 13, 2022

Filed:

May. 08, 2018

Thermistor die-based thermal probe

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Matthew David Romig, Wylie, TX (US);

Steven Aldred Kummerl, Carrollton, TX (US);

Steve Edward Harrell, Corinth, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Ronald O. Neerings

Frank D. Cimino

Primary Examiner:

Gail Kaplan Verbitsky

Int. Cl.
CPC ...
H01C 7/10 (2006.01); G01K 1/08 (2021.01); H01C 7/00 (2006.01); G01K 7/24 (2006.01); H01C 1/01 (2006.01); H01C 1/034 (2006.01); H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
G01K 1/08 (2013.01); G01K 7/24 (2013.01); H01C 1/01 (2013.01); H01C 1/034 (2013.01); H01C 7/008 (2013.01); H01C 17/006 (2013.01);
Abstract

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W, Wthat extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

Find Patent Forward Citations

Romig, Matthew. (2022). Thermistor die-based thermal probe (U.S. Patent No. 11525739). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11525739

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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