The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Aug. 10, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Abram M. Castro, Fort Worth, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49524 (2013.01); H01L 21/4825 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/566 (2013.01); H01L 21/568 (2013.01); H01L 23/3185 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 24/14 (2013.01); H01L 24/96 (2013.01); H01L 2224/14131 (2013.01);
Abstract

A surface mount electronic device providing an electrical connection between an integrated circuit (IC) and a printed circuit board (PCB) is provided and includes a die and a dielectric material formed to cover portions of the die. Pillar contacts are electrically coupled to electronic components in the die and the pillar contacts extend from the die beyond an outer surface of the die. A conductive ink is printed on portions of a contact surface of the electronic device package and forms electrical terminations on portions of the dielectric material and electrical connector elements that connect an exposed end surface of the pillar contacts to the electrical terminations.


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