Texas Instruments Corporation

Substrate Technologies Incorporated

Amkor Electronics, Inc.

Touch Future Technolocy Ltd.

Abram M Castro

Rongwei Zhang

Mark Allen Gerber

Benjamin Stassen Cook

Kurt Peter Wachtler

Matthew David Romig

Yong Lin

Bernardo Gallegos

Aaron R Castro

Sreenivasan Kalyani Koduri

Juan Alejandro Herbsommer

Steven Alfred Kummerl

Enis Tuncer

Usman Mahmood Chaudhry

Mahmud Halim Chowdhury

Saumya Gandhi

Joe Adam Garcia

William H Maslakow

John R McMillan

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same

An integrated circuit (IC) chip can include a die with an interconnect conductively coupled to a leadframe, wherein the leadframe forms a portion of a given surface of the IC chip. The IC chip can also include an encapsulating material molded over the die and the leadframe. The encapsulating material can form another surface of the IC chip. The other surface of the IC chip opposes the given surface of the IC chip. The IC chip can further include a vertical wire extending through the encapsulating material in a direction that is substantially perpendicular to the given surface of the IC chip and the vertical wire protruding through the other surface of the IC chip to form a vertical connector for the IC chip. The vertical connector can be coupled to the interconnect on the die.

Integrated circuit chip with a vertical connector

An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate.

Acoustic device package and method of making

In some examples, a device comprises an electronic component having multiple electrical connectors, the multiple electrical connectors configured to couple to a printed circuit board (PCB) and having a first footprint. The device also comprises a multi-lead adapter comprising multiple rows of leads arranged in parallel, the leads in the rows configured to couple to the electrical connectors of the electronic component and having a second footprint that has a different size than the first footprint.

Multi-lead adapter

A surface mount electronic device providing an electrical connection between an integrated circuit (IC) and a printed circuit board (PCB) is provided and includes a die and a dielectric material formed to cover portions of the die. Pillar contacts are electrically coupled to electronic components in the die and the pillar contacts extend from the die beyond an outer surface of the die. A conductive ink is printed on portions of a contact surface of the electronic device package and forms electrical terminations on portions of the dielectric material and electrical connector elements that connect an exposed end surface of the pillar contacts to the electrical terminations.

Integrated circuit package electronic device

An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).

Integrated circuit package electronic device including pillar contacts and electrical terminations

A packaged semiconductor system, including: at least one electronic device on a device mounting surface of a substrate having terminals for attaching bond wires; at least one discrete component adjacent to the at least one electronic device, a second electrode of the at least one discrete component parallel to and spaced from a first electrode by a component body; the first electrode a metal foil having a protrusion extending laterally from the body and having a surface facing towards the second electrode; bonding wires interconnecting respective terminals of the at least one electronic device, the first electrode and the second electrode, and bonded to the surface of the second electrode and to the protrusion that extend away from the respective surfaces in a same direction; and packaging compound covering portions of the at least one electronic device, the at least one discrete component, and the bonding wires.

Packaged semiconductor system having unidirectional connections to discrete components

A method includes applying a die attach material to a die pad of an integrated circuit package. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit package to mitigate delamination between the integrated circuit die and the die pad.

Printed adhesion deposition to mitigate integrated circuit package delamination

A method includes applying a die attach material to a die pad of an integrated circuit. The die attach material is employed as a bonding material to the die pad. The method includes mounting an integrated circuit die to the die pad of the integrated circuit via the die attach material. The method includes printing an adhesion deposition material on the die attach material appearing at the interface of the integrated circuit die and the die pad of the integrated circuit to mitigate delamination between the integrated circuit die and the die pad.

Printed adhesion deposition to mitigate integrated circuit delamination

The assembly of a chip () attached to a substrate () with wires () spanning from the chip to the substrate is loaded in a heated cavity () of a mold; the wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound (); a pressure chamber () of the mold is loaded with a solid pellet () of a packaging material including a polymerizable resin, the chamber being connected to the cavity; the vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners () before filling the mold cavity, whereby the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces.

Growing community of inventors

Fort Worth, TX, United States of America

Abram M Castro