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For the Inventor, By the Inventor

Scottsdale, AZ, United States of America

Robert C Marrs

USPTO Granted Patents = 13

Average Co-Inventor Count = 1.2

ph-index = 13

Forward Citations = 1,057(Granted Patents)


Location History:

  • Scottdale, AZ (US) (1998)
  • Scottsdale, AZ (US) (1994 - 2000)

Company Filing History:

goldMedal11 out of 40 
 
Amkor Electronics, Inc.
 patents
silverMedal3 out of 1,586 
 
Teijin Limited
 patents
bronzeMedal2 out of 1,009 
 
Amkor Technology, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1994-2000

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13 patents (USPTO):Explore Patents
1. 6163463 - Integrated circuit chip to substrate interconnection (2000-12-19),
2. 5795818 - Integrated circuit chip to substrate interconnection and method (1998-08-18),
3. 5722161 - Method of making a packaged semiconductor die including heat sink with (1998-03-03),
4. 5701034 - Packaged semiconductor die including heat sink with locking feature (1997-12-23),
5. 5583378 - Ball grid array integrated circuit package with thermal conductor (1996-12-10),
6. 5485037 - Semiconductor device having a thermal dissipator and electromagnetic (1996-01-16),
7. 5483100 - Integrated circuit package with via interconnections formed in a (1996-01-09),
8. 5482898 - Method for forming a semiconductor device having a thermal dissipator (1996-01-09),
9. 5478007 - Method for interconnection of integrated circuit chip and substrate (1995-12-26),
10. 5455462 - Plastic molded package with heat sink for integrated circuit devices (1995-10-03),
11. 5378869 - Method for forming an integrated circuit package with via interconnection (1995-01-03),
12. 5355283 - Ball grid array with via interconnection (1994-10-11),
13. 5328870 - Method for forming plastic molded package with heat sink for integrated (1994-07-12),

Title: The Innovations of Robert C. Marrs

Introduction

Robert C. Marrs is a notable inventor based in Scottsdale, Arizona, recognized for his significant contributions to the field of integrated circuit technology. With a total of 13 patents to his name, Marrs has made a lasting impact on the electronics industry through his innovative designs and methods.

Latest Patents

Among his latest patents is the "Integrated Circuit Chip to Substrate Interconnection." This invention details a method for forming an interconnection between bonding pads on an integrated circuit chip and corresponding bonding contacts on a substrate. The process involves creating a metallization on each substrate bonding contact, forming metal ball bond bumps on selective bonding pads, and then coining them. The substrate and integrated circuit chip are heated, and the coined ball bond bumps are placed into contact with the metallizations. By applying pressure and ultrasonic energy, a metal-to-metal bond is formed, ensuring a reliable connection.

Career Highlights

Marrs has worked with prominent companies in the electronics sector, including Amkor Electronics, Inc. and Teijin Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in integrated circuit technology.

Collaborations

Throughout his career, Marrs has collaborated with esteemed colleagues such as Tadashi Hirakawa and Ronald J. Molnar. These partnerships have fostered an environment of innovation and creativity, leading to the development of several key technologies in the industry.

Conclusion

Robert C. Marrs stands out as a pioneering inventor in the realm of integrated circuits, with a proven track record of innovation and collaboration. His contributions continue to influence the electronics industry, showcasing the importance of creativity and technical expertise in driving technological advancements.

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