Method for interconnection of integrated circuit chip and substrate

Abstract

According to the invention, a method and structure for flip chip interconnection of an integrated circuit chip to a substrate is provided. The method and structure of the invention overcome the problems associated with interconnecting the chip to the substrate by wirebonding and are less expensive than prior art flip chip interconnection methods and structures. Conventional integrated circuit chips that have been made using wafer fabrication processes for wirebonding chip-level interconnection are electrically connected to a substrate using a flip chip interconnection. Conventional wirebonding equipment can be used to bump chips for use in the invention. In one embodiment of the invention, an integrated circuit includes a semiconductor die mounted on a substrate such that electrically conductive material formed on each of the bond pads of the semiconductor die extends through a corresponding well formed in a dielectric layer on the substrate to contact electrically conductive material formed in the surface of the substrate on which the dielectric layer is situated. In another embodiment of the invention, the electrically conductive material is a coined ball bond, which can have, for instance, a conical section on top of a base section. The wells can be formed by any of a number of methods such as mechanical drilling, laser drilling, chemical etching or plasma etching.