The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 1996
Filed:
May. 16, 1994
Applicant:
Inventors:
Robert C Marrs, Scottsdale, AZ (US);
Ronald J Molnar, Phoenix, AZ (US);
Assignee:
Amkor Electronics, Inc., Chandler, AZ (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257710 ; 257712 ; 257718 ; 257730 ;
Abstract
A ball grid array package and low cost method for manufacture of the same is disclosed herein. The ball grid array package includes a thermal conductor which is a linearly co-extensive outer layer of an interconnection substrate and forms the outer surface of the ball grid array package. An integrated circuit chip is positioned on the underside of the package in a well region. The well region is either formed directly in the interconnection substrate or is formed by the application of a dam. The well region is then filled with an insulating encapsulant material to a predetermined level.