Company Filing History:
Years Active: 1997-1998
Title: The Innovations of John R. McMillan
Introduction
John R. McMillan is a notable inventor based in Southlake, Texas, with a focus on advancements in semiconductor technology. He holds three patents that showcase his expertise and innovative spirit in the field of integrated circuit packaging.
Latest Patents
One of his latest patents is the "Socket assembly for integrated circuit chip carrier package." This invention features a socket designed for a ball grid array chip carrier package that contains a die, which is electrically interconnected. The design incorporates individual spring elements that interconnect each ball of the ball grid array, providing upward pressure against sections of a substrate in direct contact with the balls. These sections are formed into individual beam members that flex in response to the pressure from the underlying spring elements. Another significant patent is the "Homogeneous chip carrier package," which describes a thermoplastic chip carrier cavity package for one or more semiconductor integrated circuit chips. This invention includes a circuit substrate made from suitable thermoplastics, such as PPS or LCP, and features a casing that is chemically fused to create a moisture seal. An encapsulant may also be used to secure and seal the chip from moisture.
Career Highlights
John R. McMillan is currently employed at Amkor Electronics, Inc., where he continues to contribute to the field of semiconductor packaging. His work has significantly impacted the efficiency and reliability of integrated circuit technologies.
Collaborations
Throughout his career, McMillan has collaborated with talented individuals such as William H. Maslakow and Marc A. Abelanet, enhancing the innovative processes within his projects.
Conclusion
John R. McMillan's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in integrated circuit packaging, showcasing the importance of innovation in technology.