The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Nov. 14, 1996
Applicant:
Inventors:
John R McMillan, Southlake, TX (US);
William H Maslakow, Lewisville, TX (US);
Marc A Abelanet, Irving, TX (US);
Assignee:
Amkor Electronics, Inc., West Chester, PA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ; H05K / ;
U.S. Cl.
CPC ...
439 70 ; 439331 ;
Abstract
A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.