The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 1998

Filed:

Aug. 29, 1995
Applicant:
Inventor:

Won Sun Shin, Seoul, KR;

Assignees:

Amkor Electronics, Inc., Chandler, AZ (US);

Anam Industrial Co., Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257666 ; 257675 ; 257707 ; 257784 ; 257667 ; 257670 ; 257691 ;
Abstract

A lead frame for semiconductor packages is disclosed. In the lead frame, some of the inner leads in the four sides are extended and provided with connection bars on their inside ends. Alternatively, diagonally arranged tie bars of the lead frame are extended and provided with a rectangular guide ring on their inside ends. The connection bar or guide ring functions as a dam for restricting possible overflow of adhesive, which adhesive is applied on the heat sink for bonding a semiconductor chip to the heat sink. The lead frame of the invention also prevents waste of expensive tape by letting the adhesive tape adhere only to the connection bars or to a given portion of the guide ring when mounting the lead frame to the heat sink and makes it possible higher integration of semiconductor chip by making connection bar and guide ring from the lead or the tie bar.


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