The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 1998
Filed:
Sep. 19, 1995
Young Wok Heo, Seoul, KR;
Dong Sin Youm, Kyungki-Do, KR;
ANAM Industrial Co., Ltd., , KR;
Amkor Electronics, Inc., , PA (US);
Abstract
A method for checking wire bonding result of a ball grid array (BGA) package is disclosed. An electroconductive metal layer of gold or copper is grounded on a chip bonding portion of a printed circuit board (PCB) of the BGA package as well as on a passage extending between the chip bonding portion and the gate of the PCB. After a wire bonding step, a probe and a capillary of a wire bonding checking system contact with the gate and with a semiconductor chip respectively. Thereafter, an electric current is sent to the BGA package from the checking system so as to check whether the BGA package sends the electric current therethrough. When there is neither a lift bond nor a missing wire in the BGA package, the package will send the current. However, when there is either a lift bond or the missing wire in the BGA package, the package will not send the current.