Young Wok Heo

Title: Young Wok Heo: Innovator in Semiconductor Technology

Introduction

Young Wok Heo is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of wire bonding methods for semiconductor packages. His innovative approach has led to the development of a patented method that enhances the reliability of semiconductor packaging.

Latest Patents

Young Wok Heo holds a patent for a "Method for checking a wire bond of a semiconductor package." This patent describes a technique for verifying the wire bonding results of a ball grid array (BGA) package. The method involves grounding an electroconductive metal layer of gold or copper on the chip bonding portion of a printed circuit board (PCB) and on a passage extending to the gate of the PCB. After the wire bonding step, a probe and capillary contact the gate and semiconductor chip, respectively. An electric current is then sent through the BGA package to determine if it successfully transmits the current. If there are no lift bonds or missing wires, the package will send the current, indicating a successful bond.

Career Highlights

Throughout his career, Young Wok Heo has worked with prominent companies in the semiconductor industry. He has been associated with Anam Industrial Co., Ltd. and Amkor Electronics, Inc., where he has contributed his expertise in semiconductor packaging and testing.

Collaborations

Young Wok Heo has collaborated with various professionals in the field, including his coworker Dong Sin Youm. Their joint efforts have further advanced the technology and methodologies used in semiconductor packaging.

Conclusion

Young Wok Heo's innovative contributions to semiconductor technology, particularly through his patented method for checking wire bonds, highlight his importance in the industry. His work continues to influence the reliability and efficiency of semiconductor packages.