Dong Sin Youm

Title: Innovations by Dong Sin Youm in Semiconductor Technology

Introduction

Dong Sin Youm is a notable inventor based in Kyungki-Do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of wire bonding methods for semiconductor packages. His innovative approach has led to the development of a patented method that enhances the reliability of semiconductor packaging.

Latest Patents

Dong Sin Youm holds a patent for a "Method for checking a wire bond of a semiconductor package." This method involves checking the wire bonding results of a ball grid array (BGA) package. The process includes grounding an electroconductive metal layer of gold or copper on a chip bonding portion of a printed circuit board (PCB) and on a passage extending between the chip bonding portion and the gate of the PCB. After the wire bonding step, a probe and a capillary of a wire bonding checking system contact the gate and the semiconductor chip, respectively. An electric current is then sent to the BGA package to verify its integrity. If the package is free from lift bonds or missing wires, it will successfully transmit the current. Conversely, any issues will prevent the current from passing through.

Career Highlights

Throughout his career, Dong Sin Youm has worked with prominent companies in the semiconductor industry. He has been associated with Anam Industrial Co., Ltd. and Amkor Electronics, Inc., where he has applied his expertise in semiconductor technology and contributed to various projects.

Collaborations

One of his notable collaborators is Young Wok Heo, with whom he has worked on advancing semiconductor technologies.

Conclusion

Dong Sin Youm's innovative methods in semiconductor packaging have made a significant impact on the industry. His patent demonstrates a practical solution for ensuring the reliability of semiconductor packages, showcasing his expertise and dedication to technological advancement.