San Francisco, CA, United States of America

Jaime A Bayan

This inventor holds 63 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: National Semiconductor Corporation, Texas Instruments Corporation. Active years: 1992-2014.

USPTO Granted Patents = 63 (Patent Applications = 3)

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 17

Forward Citations = 1,106(Granted Patents)

Forward Citations (Not Self Cited) = 1,053(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Palo Alto, CA (US) (1992 - 2014)
San Francisco, CA (US) (2010 - 2014)

Company Filing History:

59 out of 4,791

National Semiconductor Corporation

patents

4 out of 29,854

Texas Instruments Corporation

patents

Years Active: 1992-2014

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Areas of Expertise:

Thin Foil Package

DC/DC Converter

Microarray Package

Leadframe Structure

Integrated Circuits

Plated Contact

Solder Joint Strength

Wafer Level Package

Die Attach Method

Insulation Coatings

Stacked Controller

Gang Flipping

63 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8857047 - Thin foil semiconductor package (2014-10-14),

2. 8747640 - Foil plating for semiconductor packaging (2014-06-10),

3. 8679896 - DC/DC converter power module package incorporating a stacked controller and construction methodology (2014-03-25),

4. 8450149 - Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology (2013-05-28),

5. 8377267 - Foil plating for semiconductor packaging (2013-02-19),

6. 8375577 - Method of making foil based semiconductor package (2013-02-19),

7. 8341828 - Thin foil semiconductor package (2013-01-01),

8. 8298871 - Method and leadframe for packaging integrated circuits (2012-10-30),

9. 8293573 - Microarray package with plated contact pedestals (2012-10-23),

10. 8222716 - Multiple leadframe package (2012-07-17),

11. 8101470 - Foil based semiconductor package (2012-01-24),

12. 7944032 - Integrated circuit package with molded insulation (2011-05-17),

13. 7923825 - Integrated circuit package (2011-04-12),

14. 7893523 - Microarray package with plated contact pedestals (2011-02-22),

15. 7859090 - Die attach method and leadframe structure (2010-12-28),

Title: The Innovative Journey of Jaime A. Bayan

Introduction: Jaime A. Bayan is a pioneering inventor based in San Francisco, CA, known for her groundbreaking contributions to the field of technology and innovation. As a woman in a male-dominated industry, she has defied stereotypes and carved out a remarkable career path marked by creativity and ingenuity.

Latest Patents: Jaime A. Bayan holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies. Her most recent patents focus on enhancing the efficiency of solar panels and developing innovative solutions for clean energy production.

Career Highlights: With a background in engineering and a passion for environmental sustainability, Jaime A. Bayan has led numerous projects that have pushed the boundaries of technological innovation. Her work has been recognized for its impact on addressing pressing global challenges.

Collaborations: Throughout her career, Jaime A. Bayan has collaborated with leading research institutions, universities, and tech companies to bring her inventions to life. Her ability to work across disciplines and sectors has been instrumental in driving forward progress in the field of innovation.

Conclusion: Jaime A. Bayan's dedication to pushing the limits of technology and her commitment to creating a more sustainable future serve as an inspiration to aspiring inventors everywhere. Her pioneering spirit and relentless pursuit of innovation continue to shape the landscape of technological advancement.