The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
May. 01, 2018
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Glenn Rinne, Apex, NC (US);
Daniel Richter, Goldsboro, NC (US);
Assignee:
AMKOR TECHNOLOGY, INC., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06177 (2013.01); H01L 2224/119 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13015 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14141 (2013.01); H01L 2224/14151 (2013.01); H01L 2224/14153 (2013.01); H01L 2224/14154 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.