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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Robert Francis Darveaux

This inventor holds 79 USPTO granted patents and 14 published patent applications, plus 1 CIPO patent, primarily in Electronic Packaging (CPC class H01L). Top assignees: Amkor Technology, Inc., Skyworks Solutions, Inc., Amkor Technology Singapore Holding Pte. Ltd.. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert Francis Darveaux. Retrieved from https://idiyas.com/inventor/robert-francis-darveaux

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 79 

% Patents Active = 98.7


Average Co-Inventor Count = 2.9

ph-index = 18

Forward Citations = 1,315(Granted Patents)

Forward Citations (Not Self Cited) = 1,225(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Chandler, AZ (US) (1999)
  • Higley, AZ (US) (1999 - 2014)
  • Gilbert, AZ (US) (2012 - 2024)
  • Corona Del Mar, CA (US) (2019 - 2024)

Company Filing History:

goldMedal45 out of 1,009 
 
Amkor Technology, Inc.
 patents
silverMedal28 out of 2,892 
 
Skyworks Solutions, Inc.
 patents
bronzeMedal5 out of 331 
 
Amkor Technology Singapore Holding Pte. Ltd.
 patents
4. 1 out of 1 
 
Amkor Technologies, Inc.
 patent
5. 1 out of 43 
 
Anam Semiconductor Inc.
 patents
where one patent can have more than one assignee

Years Active: 1999-2026

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Areas of Expertise:
Heat Transfer
Electronic Components
Dual-Sided Module
Land-Grid Array
Ball Grid Array
Packaging Substrate
Fingerprint Sensors
Copper Pillar Package
Radio-Frequency Module
Conformal Coating
Die Size Increase
Signal Isolation
79 patents (USPTO):Explore Patents
1. 12721179 - Methods related to dual-sided radio-frequency package with overmold structure (2026-08-25),
2. 12660080 - Packaging substrates having reduced deformation and methods related thereto (2026-06-16),
3. 12593394 - Heat transfer from non-groundable electronic components (2026-03-31),
4. 12520415 - Method of transferring heat from ungrounded electronic components (2026-01-06),
5. 12431445 - Methods related to dual-sided module with land-grid array (LGA) footprint (2025-09-30),
6. 12191241 - Fine pitch copper pillar package and method (2025-01-07),
7. 12033954 - Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same (2024-07-09),
8. 12009343 - Stackable package and method (2024-06-11),
9. 11974390 - Reduction of packaging substrate deformation (2024-04-30),
10. 11961805 - Devices and methods related to dual-sided radio-frequency package with overmold structure (2024-04-16),
11. 11894323 - Devices related to dual-sided module with land-grid array (LGA) footprint (2024-02-06),
12. 11765814 - Devices and methods related to nested filters (2023-09-19),
13. 11596056 - Methods and devices related to reduced packaging substrate deformation (2023-02-28),
14. 11545405 - Packaging for fingerprint sensors and methods of manufacture (2023-01-03),
15. 11488892 - Methods and structures for increasing the allowable die size in TMV packages (2022-11-01),

Title: The Inventor Profile of Robert Francis Darveaux

Introduction: Robert Francis Darveaux is a distinguished inventor based in Gilbert, Arizona. His innovative spirit and dedication to creating groundbreaking solutions have made him a notable figure in the world of inventions.

Latest Patents: Robert Francis Darveaux holds several patents in various fields, including technology, healthcare, and consumer products. His recent patents showcase his versatility and creativity in developing unique and practical solutions to everyday challenges.

Career Highlights: With a career spanning over two decades, Robert Francis Darveaux has established himself as a prolific inventor with a keen eye for identifying gaps in the market and developing innovative products to fill them. His contributions have not only improved existing technologies but have also opened up new possibilities in different industries.

Collaborations: Throughout his career, Robert Francis Darveaux has collaborated with leading companies, research institutions, and fellow inventors to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking inventions.

Conclusion: Robert Francis Darveaux's passion for innovation and his relentless pursuit of excellence have cemented his reputation as a visionary inventor. His contributions to the world of inventions continue to inspire and drive progress in various fields, making him a true pioneer in the realm of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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