The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Apr. 10, 2024
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Howard E. Chen, Anaheim, CA (US);

Robert Francis Darveaux, Corona Del Mar, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/60 (2026.01); H05K 1/181 (2026.01); H10P 14/40 (2026.01); H10P 14/44 (2026.01); H10P 54/00 (2026.01); H10P 72/70 (2026.01); H10W 20/00 (2026.01); H10W 42/20 (2026.01); H10W 44/20 (2026.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 74/01 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10W 20/20 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H05K 1/181 (2013.01); H10P 14/412 (2026.01); H10P 14/44 (2026.01); H10P 54/00 (2026.01); H10P 72/7402 (2026.01); H10W 20/056 (2026.01); H10W 20/081 (2026.01); H10W 44/20 (2026.01); H10W 70/093 (2026.01); H10W 70/635 (2026.01); H10W 70/65 (2026.01); H10W 74/012 (2026.01); H10W 74/014 (2026.01); H10W 74/016 (2026.01); H10W 74/15 (2026.01); H10W 90/701 (2026.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H10P 72/7416 (2026.01); H10W 20/20 (2026.01); H10W 44/206 (2026.01); H10W 44/209 (2026.01); H10W 70/60 (2026.01); H10W 70/657 (2026.01); H10W 72/0198 (2026.01); H10W 72/072 (2026.01); H10W 72/07553 (2026.01); H10W 72/537 (2026.01); H10W 72/5445 (2026.01); H10W 72/879 (2026.01); H10W 74/111 (2026.01); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 90/721 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01); H10W 90/754 (2026.01);
Abstract

A method for implementing a packaged radio-frequency device is disclosed, including providing a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The method includes implementing a package on the first side of the packaging substrate, the package including a first overmold structure. The method further includes implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections defining a mounting area on the second side of the packaging substrate. The method also includes mounting a component to the second side of the packaging substrate. The method additionally includes implementing a second overmold structure on the second side, the second overmold structure substantially encapsulating at least a portion of the component and including an underside surface.


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